Products and Services

  1. CLTE: RF & Microwave Laminate
    5/18/2005
    CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
  2. IsoClad: RF & Microwave Laminates
    12/7/2007
    IsoClad laminates are nonwoven fiberglass/PTFE composites for use as printed circuit board substrates. The nonwoven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape. Conformal or “wrap-around” antennas are a good example
  3. AD1000: High Dielectric Constant Laminate
    5/18/2005
    AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
  4. Laminate For RF And Microwave Printed Circuit Boards: AD255C
    10/19/2010
    Arlon’s AD255C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD255C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
  5. PIM Series: Passive Intermodulation Laminates
    5/18/2005
    Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
  6. High-Frequency Laminates and Circuits
    7/26/2000
    The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
  7. AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate
    3/13/2006
    AD300A is a woven fiberglass reinforced PTFE/Microfine Ceramic composite material and is a significant improvement in cost/performance over traditional fluoropolymer-glass laminates. This combination offers designers an advantage for improving electrical performance through the use of advanced material without the additional cost traditionally associated with higher performance...
  8. Laminate For RF And Microwave Printed Circuit Boards: AD300C
    10/19/2010
    Arlon’s AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.
  9. Laminate For RF And Microwave Printed Circuit Boards: AD250C
    10/19/2010
    Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
  10. RF And Microwave Laminates
    12/3/2008
    Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.