CLTE: RF & Microwave Laminate
CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable,
low water absorption laminate with a nominal Dielectric Constant of 2.98.
High-Frequency Laminates and Circuits
The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
PIM Series: Passive Intermodulation Laminates
Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
IsoClad: RF & Microwave Laminates
IsoClad laminates are nonwoven fiberglass/PTFE composites for use as
printed circuit board substrates. The nonwoven reinforcement allows these
laminates to be used more easily in applications where the final circuit will
be bent to shape. Conformal or “wrap-around” antennas are a good example
AD Series: RF And Microwave Laminates
Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE
resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications
Laminate For RF And Microwave Printed Circuit Boards: AD250C
Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
AD1000: High Dielectric Constant Laminate
AD1000 is a high dielectric constant
substrate that permits circuit miniaturization
compared to traditional low loss materials. It is
especially beneficial for power amplifiers, filters,
couplers and other components using low
Laminate For RF And Microwave Printed Circuit Boards: AD300C
Arlon’s AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.
High Frequency Circuit Materials: RO4835™
Rogers Corporation offers an array of RO4835™ high frequency circuit materials designed to operate up to 40 GHz, and provide 10x more resistance to oxidation than standard RF thermoset materials. These laminates feature a dielectric constant of 3.48 with a dissipation factor of 0.0037 (measured at 10 GHz). They are ideal for power amplifiers, phased-array radar, automotive radar, sensor applications, and other applications requiring low insertion loss.
CuClad: RF & Microwave Laminates
CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability