Empower RF offers a low-power series of smart RF and microwave amplifier systems equipped with feature rich software control. They are suitable for a variety of configurations including those in multi-octave bandwidth high-power CW, modulated, and pulse applications.
The CMD186P3 is a broadband MMIC low noise amplifier housed in a leadless 3x3 mm plastic surface mount package. The CMD186P3 is ideally suited for EW and communications systems where small size and low power consumption are needed.
Atlanta Micro’s AM1031 gain block amplifier features 13 dB gain, a 2.0dB noise figure, +30 dBm OIP3, +17 dBm P1dB, a +3.3V, 56 mA supply, and high stability. It covers the 20 MHz to 8 GHz frequency range and comes in a 3mm QFN package.
Qorvo offers the new QPB9329 highly integrated front-end module with operation in the 3.8 – 5.0 GHz frequency range for TDD base station, wireless infrastructure, small cell BTS, and pre-5G/5G massive MIMO applications. This LNA module integrates a two-stage LNA and a high power switch in a dual-channel configuration.
Low noise amplifiers (LNAs) from Millitech feature state-of-the-art noise figure performance, wideband coverage, a modular, compact design, internal voltage regulation and bias circuitry, and 2.92, 2.4, 1.85 mm or Waveguide interfaces (as required).
Custom MMIC introduces the CMD163 as a high dynamic range GaAs low noise amplifier (LNA) designed for military, space, and communications systems where small size and high linearity are required. This device delivers greater than 24 dB of gain with a corresponding output 1 dB compression point of +19 dBm, and a noise figure of 1.3 dB. It is optimized for 21 GHz operation.
Qorvo offers a series of single pole triple throw (SP3T) SOI switches and switches + LNA modules for automotive WiFi, automotive data and diagnostics, infotainment, key fob, IEEE802.11b/g/n/ac WiFi, and 2.5 GHz ISM band applications. Four models are available; two of them are WiFi switches, and two of them are WiFi switches with a low noise amplifier (LNA) in a front end module (FEM). With an ultra-small form factor and integrated matching, the number of external components and layout area in the customer applications, as well as the bill of materials, system footprint, and manufacturing cost are greatly reduced.