TEST & MEASUREMENT APPLICATION NOTES AND WHITE PAPERS

• Electronic Packaging: Using EMI Material-Based Solutions

  It can be difficult when individual components could pass EMI testing but, as the components are combined into subsystems or into the final product, the DUT fails. Incorporating EMI shielding materials as part of an initial design is the most cost-effective way to prevent these last-minute issues during testing.

• Solving Tomorrow's Obsolescence Challenges Today

  This white paper discusses best practices in operations implementation, hardware acquisition, and software design to reduce the sustainment burden of handling obsolescence in test systems long before the equipment goes end of life.

• Navigating Design Complexities With Qorvo's Innovative Software Tools

  Unlock the power of Qorvo's Design Hub, providing engineers with cutting-edge RF and analog design tools previously exclusive to Qorvo teams. Streamline your projects with precision and efficiency.

• Making Higher Accuracy Oscilloscope Measurements

  One of the most important functional blocks in a digital oscilloscope is the analog-to-digital converter or ADC. This white paper explains why ADC resolution has become a more important consideration in oscilloscopes, especially for measuring small signal details.

• On-Wafer Characterization At sub-THz Frequencies

  New technologies and applications extend into sub-THz frequencies in the D band and beyond. New semiconductor technologies and processes need to be commercialized to support these efforts.