TEST & MEASUREMENT APPLICATION NOTES AND WHITE PAPERS

• Solving Tomorrow's Obsolescence Challenges Today

  This white paper discusses best practices in operations implementation, hardware acquisition, and software design to reduce the sustainment burden of handling obsolescence in test systems long before the equipment goes end of life.

• Field Probe Correction Factors

  To better achieve accurate field level measurements, it is helpful to have an understanding of field probe calibrations, the factors generated, and what’s presented as data during testing. This application note presents how to utilize the factors presented for inclusion into test data, how to generate composite measurements, and why calibrations are performed at selected frequencies.

• DPX® Acquisition Technology For Spectrum Analyzers Fundamentals

  Signal detection is the first step in characterizing, diagnosing, understanding, and resolving any problem that relates to time-variant signals. Engineers are requiring better tools to help find and interpret complex signal behaviors and interactions. The Tektronix Digital Phosphor technology, or DPX®, can be used in Real-Time Spectrum Analyzers (RSAs) to reveal signal details that are completely missed by conventional spectrum analyzers and vector signal analyzers. This white paper describes the methods behind the DPX Live RF spectrum display, swept DPX, Time-Domain DPX Displays, DPX Density™ measurements, DPX Density™ and Frequency Edge triggers.

• Basic Bulk Current Injection Testing

  Bulk current injection (BCI) testing is a conducted susceptibility procedure that uses an injection current probe. This paper provides an example of BCI testing, covering all steps, including gathering the required equipment, pre-calibration procedures, injection testing procedures, and safety precautions.

• Electronic Packaging: Using EMI Material-Based Solutions

  It can be difficult when individual components could pass EMI testing but, as the components are combined into subsystems or into the final product, the DUT fails. Incorporating EMI shielding materials as part of an initial design is the most cost-effective way to prevent these last-minute issues during testing.