Laminates

PRODUCTS AND SERVICES

High Frequency Circuit Materials: RO4835™ High Frequency Circuit Materials: RO4835™

Rogers Corporation offers an array of RO4835™ high frequency circuit materials designed to operate up to 40 GHz, and provide 10x more resistance to oxidation than standard RF thermoset materials. These laminates feature a dielectric constant of 3.48 with a dissipation factor of 0.0037 (measured at 10 GHz). They are ideal for power amplifiers, phased-array radar, automotive radar, sensor applications, and other applications requiring low insertion loss.

AD1000: High Dielectric Constant Laminate AD1000: High Dielectric Constant Laminate
AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
AD450: RF & Microwave Laminate AD450: RF & Microwave Laminate
Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
Laminate Composites For RF/Microwave Applications Laminate Composites For RF/Microwave Applications
Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.
Laminate For RF And Microwave Printed Circuit Boards: AD250C Laminate For RF And Microwave Printed Circuit Boards: AD250C
Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate
AD300A is a woven fiberglass reinforced PTFE/Microfine Ceramic composite material and is a significant improvement in cost/performance over traditional fluoropolymer-glass laminates. This combination offers designers an advantage for improving electrical performance through the use of advanced material without the additional cost traditionally associated with higher performance...
AD350A: RF & Microwave Laminate AD350A: RF & Microwave Laminate
Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
CuClad: RF & Microwave Laminates CuClad: RF & Microwave Laminates
CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability
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