Laminates

Arlon’s AD255C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD255C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.

Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.

Arlon’s AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.

AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.

IsoClad laminates are nonwoven fiberglass/PTFE composites for use as printed circuit board substrates. The nonwoven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape. Conformal or “wrap-around” antennas are a good example

The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...

Rogers Corporation offers an array of RO4835™ high frequency circuit materials designed to operate up to 40 GHz, and provide 10x more resistance to oxidation than standard RF thermoset materials. These laminates feature a dielectric constant of 3.48 with a dissipation factor of 0.0037 (measured at 10 GHz). They are ideal for power amplifiers, phased-array radar, automotive radar, sensor applications, and other applications requiring low insertion loss.

Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.