Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE
resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications
AD300A is a woven fiberglass reinforced PTFE/Microfine Ceramic composite material and is a significant improvement in
cost/performance over traditional fluoropolymer-glass laminates. This combination offers designers an advantage for
improving electrical performance through the use of advanced material without the additional cost traditionally
associated with higher performance...
IsoClad laminates are nonwoven fiberglass/PTFE composites for use as
printed circuit board substrates. The nonwoven reinforcement allows these
laminates to be used more easily in applications where the final circuit will
be bent to shape. Conformal or “wrap-around” antennas are a good example
Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.
Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.
Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability
