Current Headlines

  1. The Week In 5G: 4/23/2019 – Apple and Qualcomm End Legal Spat, Intel Exits 5G Modem Market

    Plus, Huawei shrugs off U.S. aggression en route to a banner Q1, the U.S. preps for its largest spectrum auction ever, Verizon launches a 5G technology contest, and more, all in this edition of The Week in 5G.

  2. Nokia's Revolutionary 5G Virtual Testing Speeds Deployment

    Nokia is making 5G deployments faster and more cost-efficient with its patent-pending 5G virtual testing environment. In its over-the-air validation area in Oulu, Finland, Nokia works with operators to simulate massive MIMO antenna beamforming performance by combining physical testing with a leading edge virtual environment.

  3. Flexible, Robust, And Ultra-Thin IC Offers Bluetooth Low Energy Connectivity In World’s Thinnest Form Factor

    Nordic Semiconductor recently announces that Boise, ID-based American Semiconductor, has selected Nordic’s nRF51822 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) for its ‘AS_NRF51 FleX-BLE’, a flexible integrated circuit (IC) that supports Bluetooth LE wireless connectivity in what American Semiconductor claims is the world’s thinnest and smallest Chip Scale Package (CSP).

  4. Raycap | STEALTH Announces InvisiWave, Its Engineered Solution For 5G mmWave Concealment

    Raycap | STEALTH has announced its new patent-pending solution, InvisiWave, for use in the concealment of 5G mmWave small cell sites.

  5. ON Semiconductor And GLOBALFOUNDRIES Partner To Transfer Ownership Of East Fishkill, NY 300mm Facility

    ON Semiconductor Corporation (“ON Semiconductor”) and GLOBALFOUNDRIES recently announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York. 

  6. Skyworks Introduces New 5 GHz 802.11ax Front-End Solution

    Skyworks is pleased to introduce the SKY85726-11, a 3.3V 5 GHz front-end solution for enterprise 802.11ax applications including access points, routers and gateways.

  7. New Wireless Platform Enables Next-Generation Connected Products To Scale The IoT

    Silicon Labs (NASDAQ: SLAB) has introduced the next generation of its Wireless Gecko platform, Series 2, designed to make Internet of Things (IoT) products more powerful, efficient and reliable.

  8. Qualcomm, China Unicom And Chinese OEMs Initiate China’s 5G Rollout

    Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, recently announced its support for China Unicom’s 5G rollout in collaboration with device OEMs nubia, OnePlus, OPPO, Vivo, Xiaomi and ZTE – all of which participated in the launch with devices powered by the flagship Snapdragon 855 Mobile Platform with the X50 5G Modem with integrated RF transceiver and Qualcomm Technologies’ RF front-end solution. China Unicom announced at the conference that it is the first announced Chinese operator expected to deliver 5G experiences to consumers.

  9. Keysight And Poul Due Jensen Foundation Open New Wireless Transceiver Research Laboratory At Aarhus University

    Keysight Technologies, Inc., a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, together with the Poul Due Jensen Foundation and Aarhus University (AU) announced the official opening, on March 12, 2019, of a new laboratory for research and innovation in wireless transceivers for next-generation communications.

  10. Pasternack Expands Its Line Of Custom Low-PIM Coaxial Cable Assemblies

    Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter wave products, has expanded its offering of low-PIM coaxial cable assemblies to offer customers even more connector options to address DAS, wireless infrastructure, multi-carrier communication systems, WISP, small cell installations and PIM testing applications.