Latest Headlines
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STMicroelectronics And MACOM RF Gallium-Nitride-On-Silicon Prototypes Achieve Technology And Performance Milestones
5/13/2022
MACOM Devices meet cost and performance targets and move effort to qualification stage Shows strong progress for resilient volume manufacturing and supply STMicroelectronics (“ST”), a global semiconductor leader serving customers across the spectrum of electronics applications, and MACOM Technology Solutions Holdings Inc. (“MACOM”), a leading supplier of semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries, have announced the successful production of radio-frequency Gallium-Nitride-on Silicon (RF GaN-on-Si) prototypes.
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Semtech’s LoRa Devices Integrated Into REYAX Technology’s New Antenna Transceiver Module
5/12/2022
Semtech Corporation, a leading global supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced that REYAX Technology, a total Internet of Things (IoT) solution provider dedicated to providing high quality modules, engineering designs and supply chain services to electronics manufacturers, has launched a new antenna transceiver module, the REYAX RYLR998 featuring Semtech’s LoRa and has 868/915MHz frequency range.
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Major Upcoming Release Of Multi-Purpose COMINT Receiver Platform - HUGIN 4000 By Novator Solutions
5/11/2022
Novator Solutions announces the upcoming release of HUGIN 4000 family of receivers optimized for strategic COMINT applications meeting tomorrows demands.
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3D Systems & Airbus Defence And Space Create Novel Passive RF Components For First Fully Reconfigurable Satellite
5/11/2022
Today, 3D Systems (NYSE:DDD) announced the company has been selected by Airbus Defence and Space to produce critical components for its industry-first satellite innovation, OneSat. 3D Systems’ Application Innovation Group (AIG) has designed an end-to-end additive manufacturing solution – comprising materials, 3D printing technology, software, and applications expertise – to produce the components required for the large antenna array on these satellites.
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AMD Enables 4G/5G Radio Access Network Solutions To Support Meta Connectivity Evenstar Program
5/11/2022
AMD today announced that its Xilinx Zynq UltraScale+ RFSoC has enabled the development of multiple Evenstar radio units (RUs) to expand 4G/5G global mobile network infrastructure. As the demand for internet connectivity continues to grow at a rapid pace, the infrastructure that supports it needs to keep pace and improve.
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What Is An SMPM Connector?
5/11/2022
SMPM stands for Sub-Miniature Push-on Micro. However, while the acronym SMPM is common in the industry, these types of connectors can go by many other names.
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Qualcomm Unveils New Features In Snapdragon X70 Modem-RF System
5/10/2022
Qualcomm Technologies, Inc., today announced at the Qualcomm 5G Summit event new capabilities and milestones for the Snapdragon X70 5G Modem-RF System.
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Advantest Introduces Industry’s First Flexible DUT Interface Enabling Increased Parallelism On V93000 EXA Scale Test Systems
5/10/2022
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has launched its DUT Scale Duo interface for the V93000 EXA Scale SoC test systems, enabling the industry’s highest level of parallelism for testing advanced semiconductors.
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Simulate Real-World RFIU Performance During System Design With Hiller Measurements Proteus RFSim
5/10/2022
Hiller Measurements today announced Proteus RFSim, a model-based design tool for evaluating real-world performance of complex RFIUs using digital-twin design.
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NIST Finds Wireless Performance Consistent Across 5G Millimeter-Wave Bands
5/10/2022
Settling a key dispute in the wireless communications field, researchers at the National Institute of Standards and Technology (NIST) found that transmission performance is consistent across different bands of the millimeter-wave (mmWave) spectrum targeted for high-speed, data-rich 5G systems.