The QPA1017D is Qorvo’s MMIC power amplifier operating from 5.7 – 7.0 GHz for C-band radar and satellite communications applications. Fabricated on Qorvo’s production 0.15 um GaN on SiC process, the amplifier produces 50 W of saturated output power with 21 dB of large-signal gain while achieving greater than 40% power-added efficiency.

Qorvo offers the CMD240C4 wideband GaAs MMIC distributed amplifier housed in a leadless 4x4 mm surface mount package. The amplifier operates from DC to 22 GHz and is ideal for radar, space, satcom, test and measurement, and electronic warfare applications.

The CMPA2060035F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC) suited for ultra broadband amplifiers, fiber drivers, EMC amplifier drivers, and test instrument applications. GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity.

The TriQuint TGA2525 is a compact LNA Gain Block MMIC with adjustable gain control (AGC). The LNA operates from 2-18 GHz and is designed using TriQuint’s proven standard 0.15 um Power pHEMT production process.



MMIc circuits are traditionally called “mimic” circuits. They are an abbreviation for Monolithic Microwave Integrated Circuit. These circuits are normal integrated circuits just like any chip except they operate on a specific frequency range. They operate in the microwave range of 300 mega hertz to 300 gig hertz.  MMIC circuits have a very small form factor. They typically contain numerous other circuits within them and are a form of hybrid. The main board is made from gallium arsenide and is mass produced by the millions. The IC itself is used in many applications from amplifications of low level noise and other microwave circuits.

MMIC have evolved over the years and as such much research has gone in to the making of new age chips. These new chips have been made to withstand huge cut off as well as increase the gain on the antennas that they are connected to. MMIC chips have reduced over the years and are now approximately 1% the size they used to be when they were first designed. These chips will further decrease in form factor from their current millimeter range into the pico meter range within a few years. The substrates materials that are currently supporting the build have also changed over the years and now include SiGE and GaN.

One thing to note is that the materials used in making these chips can be harmful to the environment if the byproducts of manufacturing are not properly disposed off.  In this category most governments have imposed laws on the disposal and incineration of chemical byproducts. The incineration processes totally any environmental issues.