Thick & Thin Film


These glass insulated, "0-Ohm", gold jumpers are ideally suited for providing interconnections and wiring crossovers in the fabrication of "chip and wire" type microelectronic modules. These jumpers allow for prototype and small quantity circuitry layouts without the need for special conductor patterns

The Established Reliability, surface-mount chip resistor networks qualified to MIL-PRF-914 (revision G, amendment 3) have increased in availability...
APECS means tighter tolerances & lower costs – Using the DuPont Fodel® process as a base technology, Anaren Ceramics’ precision thick film technology (better known as APECS) pushes thick film technology to a best-in-class position from which we can meet or exceed thin film tolerances -- at a far more affordable price point.
The FCRN303 series SMD resistor chips are drop-in replacements to traditional 0805 chips, such as the PTN Series thin film resistors from Vishay
The ITF High Directivity LGA Coupler is based on thin-film multilayer technology. The technology provides a miniature part with excellent high frequency performance and rugged construction for reliable automatic assembly.

MSI has beem the leading manufacturer of Precision Hi-Reliability Chip Resistors for more than 30 years. MSI's products are designed for superior solder fillets for optimum performance in the area of stability, solderability, adhesion, power dissipation, and life.

Cobham MAL Ltd. has retained a thin film processing capability at its Milton Keynes facility for over 25 years. This well developed and regularly used process has been exploited by Cobham in its microwave assemblies and has been qualified into a number of aerospace, defense, communications and space products.

Wire and ribbon bondable and Flipchip thick film chip attenuators are printed and fired on 96% alumina. They provide attenuation accuracy for frequencies through 10 Ghz. Double layer terminations provide additional bonding surface, while abrasive trimming ensures optimum resistor stability