Latest Headlines
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Quectel Launches FCE870Q Wi-Fi7 And Bluetooth 6.0 Module For Low Latency Use Cases
3/3/2026
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the FCE870Q Wi-Fi7 and Bluetooth 6.0 module.
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Keysight And Qualcomm Advance RF Digital Twins To Scale Massive MIMO And AI-Native 6G Research
3/3/2026
Keysight Technologies, Inc. collaborated with Qualcomm Technologies, Inc. to accelerate high-precision Radio Frequency (RF) digital twins for massive multiple-input multiple-output (MIMO) development in 5G-Advanced and emerging 6G networks.
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Circuits Integrated Announces CI-ONE Family Of Ka-Band Integrated Switch Power Amplifiers, Enabling Ultra-Compact, Cost-Optimized Satcom Architectures
3/3/2026
Circuits Integrated Hellas (CIH), a pioneering innovator in advanced satellite communication (Satcom) technology, today announced the CI-ONE family of small-form-factor integrated PA + SPDT modules.
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Sivers Semiconductors To Showcase Cutting-Edge SATCOM And Fixed Wireless Innovations At MWC Barcelona
3/2/2026
Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, today announced its participation at MWC Barcelona, March 2-5, 2026.
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HARMAN And Viasat Collaborate To Enable In-Cabin Voice Calls Over Satellite Communications
3/2/2026
MWC Barcelona 2026 – HARMAN, the automotive technology leader and subsidiary of Samsung Electronics Co., Ltd., announces a new collaboration with Viasat Inc., a global leader in satellite communications, to introduce in-cabin voice calling over satellite connectivity.
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Rohde & Schwarz Achieves New Milestone For 6G With FR1–FR3 Carrier Aggregation
3/2/2026
Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another important milestone for the 6G ecosystem research and development, demonstrating carrier aggregation across the FR1 and FR3 frequency bands. This joint achievement will be presented live at MWC Barcelona 2026.
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Nordic Semiconductor Accelerates Cellular IoT Leadership With Major New Product Releases At MWC 2026
3/2/2026
Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today announces a major expansion of its ultra-low-power cellular IoT products and technologies designed to deliver secure, global connectivity as networks and satellite NTN evolve.
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Saelig Announces The STD-504 Compact True-Diversity 2.4 GHz Radio Transceiver Module
3/2/2026
Saelig Company, Inc. has introduced the STD-504 transceiver, designed for reliable communication in the crowded the ISM 2.4 GHz band. Allowing for worldwide operation, the STF-504 is compliant with EN, FCC, ISED and ARIB standards to suit the global market.
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Forefront RF To Unveil Industry's First Commercial Low-Band Tunable Duplexer At Mobile World Congress 2026
3/2/2026
At Mobile World Congress (MWC) 2026. Forefront RF, a Cambridge-based fabless semiconductor scale-up, has launched, what it believes to be the industry’s first commercially available tunable duplexer module, the FFM51010, implemented without SAW or BAW acoustic filtering.
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Samji Electronics Selects MaxLinear's Sierra Single-Chip Radio For High-Performance Macro O-RU
3/2/2026
MaxLinear, Inc., a leading provider of wireless infrastructure solutions, today announced that Samji Electronics has selected MaxLinear’s Sierra single‑chip radio system‑on‑chip (SoC) to power its next‑generation Macro Open RAN Radio Unit (O‑RU) (SNOO2‑44N28).