Current Headlines

  1. Modelithics And International Manufacturing Services (IMS) Release New Models For Attenuators And Resistors
    1/31/2019

    Modelithics and International Manufacturing Services (IMS) have completed the development of eight new broadband Microwave Global Models for IMS attenuator and resistor families. The models were developed through the Modelithics Vendor Partner (MVP) Program under a 6-year collaboration plan recently established between Modelithics and IMS.

  2. Rohde & Schwarz Presents VNAs With Multiport Architecture For Measurements From 100 kHz To 40 GHz
    1/31/2019

    Thanks to its frequency range up to 40 GHz, manufacturers of active and passive components can use the new R&S ZNBT40 vector network analyzer for a wide variety of multi-antenna communications systems (MIMO, SISO, MISO), including radar systems for the A&D sector.

  3. Pixus Develops Ruggedized Software Defined Radio Solutions
    1/30/2019

    Pixus Technologies, a provider of embedded computing and enclosure solutions, has developed ruggedized versions of commercial software defined radios.

  4. Sivers IMA Sign Agreement For Use Of Unlicensed 5G In Ultra Sonic Examination Application
    1/30/2019

    This company has a focus on utilizing wireless data transfer technology in their new products. Sivers IMA will participate in the development of an unlicensed 5G (WiGig) solution to be used for wireless transfer of high definition ultra sonic data. The estimates order value relating to the proof of concept phase is not significant.

  5. Passive Plus, Inc. Announces Air Variable Capacitors Line
    1/30/2019

    Passive Plus, Inc. (PPI) is now offering Air Variable Capacitors: HI-Q Air Plate, Air Tubular and Sapphire Trimmer Capacitors. With over hundreds of standard Trimmer Capacitors available, PPI will work with engineers who need a custom part built to their specifications.

  6. The Week In 5G: 1/29/2019 – Samsung Alters 5G Plans, U.S. Pressures Allies To Block Huawei
    1/29/2019

    Plus, the US FCC is accused of colluding with telcos to rig 5G rules as it wraps up its 38 GHz auction, German telcos grudgingly apply to participate in that nation's spectrum auction, and the end of cloud computing in the era of 5G is pondered, all in this edition of The Week in 5G. 

  7. Fully-Automated PCB Prototyping
    1/29/2019

    Electronics developers prefer to create their printed circuit boards directly in the laboratory. This is fast and easy with the new circuit board plotters from LPKF Laser & Electronics AG, and it requires no time-consuming etching.

  8. mmWave Coalition Urges NTIA To Broaden Spectrum Access
    1/29/2019

    The mmWave Coalition met with Julius Knapp, Chief of the Office of Engineering and Technology and an extended OET staff representatives. The meeting was a follow-up to an ex parté filing by the Coalition on the allocations above 95 GHz.

  9. Test Methods To Verify Latest High-Speed Communications Technologies To Be Showcased By Anritsu Company At DesignCon 2019
    1/29/2019

    Anritsu Company will provide test solutions and techniques to verify high-speed communications featuring the latest technologies, including PCI Express (PCIe) 3.0/4.0/5.0 and Ethernet PAM4, during DesignCon 2019, to be held January 29-31 in Santa Clara, CA.

  10. Pentek’s Jade Architecture SOSA Aligned LVDS XMC Module With Optical I/O Now Available
    1/29/2019

    Pentek, Inc., recently introduced the newest member of the Jade family of data converter XMC modules. The Model 71813 is based on the Xilinx Kintex Ultrascale FPGA and features 28 pairs of LVDS digital I/O to meet the requirements of emerging standards from The Open Group Sensor Open Systems Architecture (SOSA) Consortium of which Pentek is a member.