Latest Headlines

  1. Ericsson Supplies RAN Compute Platform For NTT DOCOMO In Japan 7/31/2026

    Ericsson’s next-generation RAN Compute platform has been selected by NTT DOCOMO, INC. (DOCOMO) for its networks in Japan, including 5G.

  2. Bourns Releases LTCC Low Pass Filters For Wireless Communication Applications Covering DC To 3800 MHz 7/30/2026

    Bourns today announced the release of the Model FLP1004N089D4, FLP1606N078D6, FLP1606N355D6, FLP1608N250D6, FLP2009N025D8, FLP2009N086D8, FLP2009N091D8, FLP2009N092D8, and FLP2009N141L3 LTCC (low-temperature co-fired ceramic) low pass filters, a family of nine models designed to address size constraints and frequency-selective filtering requirements in wireless communication designs.

  3. SAIC Awarded New $70M Task Order For DoW Radar Engineering And Technical Support Services 7/30/2026

    Science Applications International Corp. (NASDAQ: SAIC) has been awarded a new $70 million task order by the U.S. Navy to provide advanced technical skills, analysis, engineering studies, modeling, and simulation of radar systems to the Radar Technologies Division of the Naval Surface Warfare Center (NSWC) Crane Division.

  4. Quectel's FGH200M Wi-Fi HaLow Module, Built On Morse Micro's MM8108, Now FCC/IC/CE/RCM Certified For Mass Production 7/30/2026

    Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today announced that Quectel's FGH200M module has passed FCC/IC/CE/RCM certification. Built on Morse Micro's MM8108 system-on-chip, the module is now cleared for mass-market production, giving IoT device makers a validated path to Wi-Fi HaLow at scale.

  5. Ultra-Efficient 5G Antenna Developed At Notre Dame Performs In Army Field Tests 7/30/2026

    In the field, the United States Army relies on fifth-generation (5G) wireless networks for secure communications, equipment tracking, and real-time health monitoring.

  6. Teledyne HiRel Semiconductors Introduces Isolated GaN Gate Driver For High-Efficiency Power Conversion Systems 7/29/2026

    Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated and a leading supplier of high-reliability semiconductor solutions, with more than a decade of experience in gallium nitride (GaN) for aerospace, defense, space and industrial applications, today announced the release of the TDGD85110EP​, an isolated, single-channel gate driver that simplifies the implementation of GaN transistors in high-performance power conversion systems.

  7. Bourns Introduces FBN Series LTCC Baluns For RF Signal Conversion And Impedance Transformation 7/29/2026

    Bourns today announced the Model FBN1606N360D6, FBN2009N090D6, FBN2009N185D6, and FBN2009N230D6 LTCC (low-temperature co-fired ceramic) baluns.

  8. NextNav And Safran Electronics & Defense Announce Agreement To Demonstrate 5G-Powered PNT Interoperability 7/29/2026

    NextNav Inc., a leader in next-generation terrestrial Positioning, Navigation, and Timing (PNT) and 3D geolocation solutions, today announced an agreement with Safran Electronics & Defense to integrate and demonstrate interoperability between NextNav's terrestrial 5G Positioning, Navigation, and Timing (PNT) network in Santa Clara County, California, and Safran’s timing and navigation receiver.

  9. Richardson RFPD Announces UMS GaAs And GaN RF Solutions For SATCOM And High-Frequency Applications 7/29/2026

    Richardson RFPD, Inc., an Arrow Electronics company, today announced the availability of a comprehensive portfolio of United Monolithic Semiconductors (UMS) GaAs and GaN RF solutions designed to help customers meet the growing performance, efficiency, and reliability demands of modern satellite communications (SATCOM) and high-frequency systems.

  10. VisionWave Files U.S. Non-Provisional Patent Application For DeepWave RF™, An AI-Powered Subsurface Sensing And Visualization Platform 7/29/2026

    VisionWave Holdings, Inc. (Nasdaq: VWAV) (“VisionWave” or the “Company”), today announced that it has filed a U.S. non-provisional utility patent application relating to its DeepWave RF™ technology, an advanced subsurface sensing and visualization platform designed for drilling, geological exploration, and related industrial applications.