Products and Services

1. AD450: RF & Microwave Laminate 5/18/2005
   Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
2. AD350A: RF & Microwave Laminate 5/18/2005
   Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
3. AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate 3/13/2006
   AD300A is a woven fiberglass reinforced PTFE/Microfine Ceramic composite material and is a significant improvement in cost/performance over traditional fluoropolymer-glass laminates. This combination offers designers an advantage for improving electrical performance through the use of advanced material without the additional cost traditionally associated with higher performance...
4. Laminate For RF And Microwave Printed Circuit Boards: AD250C 10/19/2010
   Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
5. IsoClad: RF & Microwave Laminates 12/7/2007
   IsoClad laminates are nonwoven fiberglass/PTFE composites for use as printed circuit board substrates. The nonwoven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape. Conformal or “wrap-around” antennas are a good example
6. PIM Series: Passive Intermodulation Laminates 5/18/2005
   Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
7. High-Frequency Laminates and Circuits 7/26/2000
   The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
8. AD1000: High Dielectric Constant Laminate 5/18/2005
   AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
9. CLTE: RF & Microwave Laminate 5/18/2005
   CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
10. CuClad: RF & Microwave Laminates 12/7/2007
    CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability