CLTE: RF & Microwave Laminate
CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable,
low water absorption laminate with a nominal Dielectric Constant of 2.98.
PIM Series: Passive Intermodulation Laminates
Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
AD1000: High Dielectric Constant Laminate
AD1000 is a high dielectric constant
substrate that permits circuit miniaturization
compared to traditional low loss materials. It is
especially beneficial for power amplifiers, filters,
couplers and other components using low
AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate
AD300A is a woven fiberglass reinforced PTFE/Microfine Ceramic composite material and is a significant improvement in
cost/performance over traditional fluoropolymer-glass laminates. This combination offers designers an advantage for
improving electrical performance through the use of advanced material without the additional cost traditionally
associated with higher performance...
IsoClad: RF & Microwave Laminates
IsoClad laminates are nonwoven fiberglass/PTFE composites for use as
printed circuit board substrates. The nonwoven reinforcement allows these
laminates to be used more easily in applications where the final circuit will
be bent to shape. Conformal or “wrap-around” antennas are a good example
High Frequency Circuit Materials: RO4835™
Rogers Corporation offers an array of RO4835™ high frequency circuit materials designed to operate up to 40 GHz, and provide 10x more resistance to oxidation than standard RF thermoset materials. These laminates feature a dielectric constant of 3.48 with a dissipation factor of 0.0037 (measured at 10 GHz). They are ideal for power amplifiers, phased-array radar, automotive radar, sensor applications, and other applications requiring low insertion loss.
AD450: RF & Microwave Laminate
Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
Laminate For RF And Microwave Printed Circuit Boards: AD250C
Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
RF And Microwave Laminates
Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.
AD Series: RF And Microwave Laminates
Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE
resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications