Products and Services

1. CuClad: RF & Microwave Laminates
   12/7/2007
   CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability
2. CLTE: RF & Microwave Laminate
   5/18/2005
   CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
3. High Frequency Circuit Materials: RO4835™
   8/15/2017

   Rogers Corporation offers an array of RO4835™ high frequency circuit materials designed to operate up to 40 GHz, and provide 10x more resistance to oxidation than standard RF thermoset materials. These laminates feature a dielectric constant of 3.48 with a dissipation factor of 0.0037 (measured at 10 GHz). They are ideal for power amplifiers, phased-array radar, automotive radar, sensor applications, and other applications requiring low insertion loss.

4. IsoClad: RF & Microwave Laminates
   12/7/2007
   IsoClad laminates are nonwoven fiberglass/PTFE composites for use as printed circuit board substrates. The nonwoven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape. Conformal or “wrap-around” antennas are a good example
5. Laminate For RF And Microwave Printed Circuit Boards: AD255C
   10/19/2010
   Arlon’s AD255C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD255C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
6. AD350A: RF & Microwave Laminate
   5/18/2005
   Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
7. AD450: RF & Microwave Laminate
   5/18/2005
   Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
8. AD Series: RF And Microwave Laminates
   12/7/2007
   Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications
9. High-Frequency Laminates and Circuits
   7/26/2000
   The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
10. PIM Series: Passive Intermodulation Laminates
    5/18/2005
    Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.