Products and Services

1. Laminate For RF And Microwave Printed Circuit Boards: AD250C 10/19/2010
   Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
2. AD Series: RF And Microwave Laminates 12/7/2007
   Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications
3. AD350A: RF & Microwave Laminate 5/18/2005
   Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
4. AD450: RF & Microwave Laminate 5/18/2005
   Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
5. High-Frequency Laminates and Circuits 7/26/2000
   The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
6. CLTE: RF & Microwave Laminate 5/18/2005
   CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
7. Laminate For RF And Microwave Printed Circuit Boards: AD300C 10/19/2010
   Arlon’s AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.
8. Laminate Composites For RF/Microwave Applications 5/18/2005
   Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.
9. AD1000: High Dielectric Constant Laminate 5/18/2005
   AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
10. Laminate For RF And Microwave Printed Circuit Boards: AD255C 10/19/2010
    Arlon’s AD255C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD255C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.