Products and Services

1. AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate
   3/13/2006
   AD300A is a woven fiberglass reinforced PTFE/Microfine Ceramic composite material and is a significant improvement in cost/performance over traditional fluoropolymer-glass laminates. This combination offers designers an advantage for improving electrical performance through the use of advanced material without the additional cost traditionally associated with higher performance...
2. IsoClad: RF & Microwave Laminates
   12/7/2007
   IsoClad laminates are nonwoven fiberglass/PTFE composites for use as printed circuit board substrates. The nonwoven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape. Conformal or “wrap-around” antennas are a good example
3. CuClad: RF & Microwave Laminates
   12/7/2007
   CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability
4. AD1000: High Dielectric Constant Laminate
   5/18/2005
   AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
5. PIM Series: Passive Intermodulation Laminates
   5/18/2005
   Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
6. AD Series: RF And Microwave Laminates
   12/7/2007
   Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications
7. High Frequency Circuit Materials: RO4835™
   8/15/2017

   Rogers Corporation offers an array of RO4835™ high frequency circuit materials designed to operate up to 40 GHz, and provide 10x more resistance to oxidation than standard RF thermoset materials. These laminates feature a dielectric constant of 3.48 with a dissipation factor of 0.0037 (measured at 10 GHz). They are ideal for power amplifiers, phased-array radar, automotive radar, sensor applications, and other applications requiring low insertion loss.

8. CLTE: RF & Microwave Laminate
   5/18/2005
   CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
9. Laminate For RF And Microwave Printed Circuit Boards: AD300C
   10/19/2010
   Arlon’s AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.
10. High-Frequency Laminates and Circuits
    7/26/2000
    The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...