Products and Services

1. CLTE: RF & Microwave Laminate
   5/18/2005
   CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
2. PIM Series: Passive Intermodulation Laminates
   5/18/2005
   Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
3. AD1000: High Dielectric Constant Laminate
   5/18/2005
   AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
4. AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate
   3/13/2006
   AD300A is a woven fiberglass reinforced PTFE/Microfine Ceramic composite material and is a significant improvement in cost/performance over traditional fluoropolymer-glass laminates. This combination offers designers an advantage for improving electrical performance through the use of advanced material without the additional cost traditionally associated with higher performance...
5. IsoClad: RF & Microwave Laminates
   12/7/2007
   IsoClad laminates are nonwoven fiberglass/PTFE composites for use as printed circuit board substrates. The nonwoven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape. Conformal or “wrap-around” antennas are a good example
6. High Frequency Circuit Materials: RO4835™
   8/15/2017

   Rogers Corporation offers an array of RO4835™ high frequency circuit materials designed to operate up to 40 GHz, and provide 10x more resistance to oxidation than standard RF thermoset materials. These laminates feature a dielectric constant of 3.48 with a dissipation factor of 0.0037 (measured at 10 GHz). They are ideal for power amplifiers, phased-array radar, automotive radar, sensor applications, and other applications requiring low insertion loss.

7. AD450: RF & Microwave Laminate
   5/18/2005
   Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
8. Laminate For RF And Microwave Printed Circuit Boards: AD250C
   10/19/2010
   Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
9. RF And Microwave Laminates
   12/3/2008
   Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.
10. AD Series: RF And Microwave Laminates
    12/7/2007
    Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications