Featured Articles

  1. The HEMP Threat
    10/23/2018

    The effects of a high-altitude electromagnetic pulse (HEMP) could lead to an upset or permanent damage of a sensitive electronic system. In this application note, the coupling response mechanism for localized systems will be discussed, specifically for the early-time HEMP environment.

  2. Handling And Adjustment Of Integra Technologies GaN-on-SiC HEMT Evaluation Kits
    10/22/2018

    Integra Technologies makes their GaN-on-SiC HEMT evaluation kits available for loan to their customers. This application note discusses how to properly handle and adjust these kits for optimal use in each application.

  3. Model-Based GaN PA Design Basics: The What And Why Of Intrinsic I-V Waveforms (Part 3)
    10/18/2018

    Understanding the impact and nuances of I-V curves is a fundamental part of learning how to design GaN power amplifiers. This is the third part in an ongoing series looking at the importance of GaN HEMT nonlinear models for rapid power amplifier (PA) design success.

  4. XFdtd Analysis Of Combined 860 MHz 4G And 28 GHz 5G Antenna Configurations In A Smartphone Design
    10/17/2018

    This example uses XFdtd® EM Simulation Software to analyze the performance and interaction of two antenna systems operating at 4G (860 MHz) and 5G (28 GHz) in close proximity in a smartphone design. The 4G antenna is intended to produce a broad pattern for wide coverage while the 5G array should produce narrow beams that can be steered by varying the phasing between elements. The 4G antenna is an inverted-L design and is located at the top of the phone. The 5G antenna array consists of four Yagi-Uda elements that are near the 4G antenna but offset by a conducting block.

  5. Role Call: Principal Systems Design Engineer
    10/15/2018

    Role Call is a series on RF Globalnet that will explore each of these topics with a “peek behind the curtain” at different jobs and career paths in the RF and microwave industry. Our most recent subject is Trushal Vijaykumar Chokshi, the Principal Systems Design Engineer at SiTime. Trushal specializes in the development of high-throughput systems for micro-electro mechanical systems (MEMS) resonators and oscillators, relying on a background in physics and electrical engineering with a focus on MEMS and analog circuits.

  6. Understanding Microstrip Filter Topologies
    10/11/2018

    The behavior of transmission lines in RF systems becomes important when the transmitted frequency’s wavelength is short enough that the length of cable becomes a significant part of a wavelength. Microstrip consists of a conducting strip separated from a ground plane by a dielectric substrate. 

  7. Implications Of Using kW Level GaN Transistors In Radar And Avionic Systems
    10/5/2018

    This white paper examines the effect of using normal Class A/B bias for kW-level GaN and LDMOS transistors used in radar and avionic systems.

  8. Millimeter-Wave Technology Overview
    10/3/2018

    The millimeter-wave (mmWave) technology market is on an upward trend, continuously adapting to new applications. This Q&A covers the basics of mmWave technology and presents what dB Control offers in this market.

  9. 5G Extreme Requirements: End-To-End Considerations
    10/3/2018

    Compiled by The Next Generation Mobile Networks (NGMN) Alliance’s 5G Extreme Requirements task force – which includes contributors such as Jaya Rao, Huawei; Joachim Sachs, Ericsson; Alan Stidwell, David Lister, Vodafone; and Javan Erfanian, Bell Canada -- this white paper aims to highlight what implications and trade-offs related to the delivery of new 5G services are relevant for mobile network operators.

  10. ESD Design Strategy For Mobile Devices: Using System-Efficient ESD Design (SEED) Methodology
    10/2/2018

    The electrostatic discharge (ESD) phenomenon is a natural occurrence that can destroy sensitive electrical circuits, even in small amounts. Part 1 of this paper explains why system-level ESD protection matters, providing insight on test models and strategies to improve system-level ESD protection in mobile devices.