Featured Articles

  1. Reimagining The Role Of Connectivity In Communications, Sensing, And Protection Of Ground Forces
    8/7/2019

    The U.S. and several NATO countries have been working on the seemingly impossible task of reducing size and weight of soldiers’ equipment while simultaneously increasing functionality and power. For engineers dealing with connectivity issues, this has brought about smaller and smaller connectors, cables and devices. Interconnected and portable devices have until now mainly been used by soldiers on covert operations. A wired tactical vest extends the concept of wearables beyond special forces by making the garments more modular, more accessible, and more affordable.

  2. NewSpace Terminal Testing Challenges And Considerations
    8/7/2019

    NewSpace networks and terminal vendors need to thoroughly test wireless communication systems and components to ensure uninterrupted operation and high quality of service. This white paper focuses primarily on the challenges ground terminals (user terminals and gateway terminals) present to design verification testing and manufacturing. Conducted and radiated test solutions are also discussed.

  3. Doherty, Balanced, Push-Pull, And Spatial Amplifier Performance Enhancement
    8/7/2019

    This application note presents a hybrid simulation-/measurement- based development methodology used to achieve enhanced amplifier performance with linear form of pre-distortion. The approach shown may be combined with DPD to achieve an even better result. It may also be used to lower DPD requirements.

  4. Designing Microwave PCBs For Successful Manufacture — Getting It Right The First Time
    8/6/2019

    With improvements in processor speed and model accuracy, it is more common for microwave circuit simulations to bear close approximation to their eventual real-world performance. However, not all pitfalls present in the successful manufacture of a complex microwave circuit are captured in simulations. 

  5. Optimization Study Of A Diplexer
    8/6/2019

    The V14 release of the NI AWR Design Environment platform includes many optimizers that automate and streamline specific applications to help designers bring their products to market more quickly and cost effectively. 

  6. RF Board Connector: Footprint Optimization
    8/1/2019

    While low frequency/low data rate applications can use a generic footprint for RF board connectors, modern bandwidths that support data rate of 56 Gbps and beyond require an optimized footprint designed and matched to a specific board stackup.

  7. EMC Pre-Compliance Fundamentals
    7/24/2019

    By using a performance EMI receiver, independent compliance test laboratories and companies with in-house self-certification labs can make radiated and conducted emissions tests, certifying a product meets local regulatory compliance standards. Learn how to make EMC pre-compliance measurements with this white paper.

  8. 3 Tactics For Configuring Phase-Coherent RF Signal Generation
    7/24/2019

    This white paper will help the reader understand phase coherence and why it matters, and offer tactics for generating phase-coherent signals.

  9. Making EMI Compliance Measurements
    7/24/2019

    Electrical or electronic equipment that uses the public power grid or has potential for electromagnetic emissions must pass EMC (electromagnetic compatibility) requirements. These requirements fall into four broad types of testing: radiated and conducted emissions testing, and radiated and conducted immunity testing. Conducted emissions testing focuses on signals present on the AC mains that are generated by the equipment under test (EUT). This application note introduces the basics of EMI compliance measurements, as well as the measurement process and regulations.

  10. Glass Sidewall Packages Provide Performance For RF Applications
    7/19/2019

    Glass sidewall packages achieve highest levels of hermeticity for hardware in space vacuums and extreme temperatures. Compared to ceramic, they deliver better RF performance thanks to their lower dielectric constant.