News

  1. Movandi Launches With RF Front End Technology For Emerging HF, mm-Wave Networks 9/6/2017

    MWC Americas -- Movandi, a venture-backed startup with a mission to revolutionize millimeter wave networks, today announced BeamX technology, a scalable RF front-end system solution.

  2. Freescale And Lansdale Partner To Manufacture Monolithic RF/IF And IF Amplifiers 6/1/2015

    Lansdale Semiconductor, Inc. recently announced the continued availability of the ML1350 and ML1490 Integrated Circuits (ICs). These IC’s were originally designed by Motorola/Freescale Semiconductor, Inc., and Lansdale has the single-source rights to globally market and manufacture them.

  3. Microsemi’s New Cesium Atomic Clock Portfolio Compliant With New ITU Standards For EPRCs 4/5/2018

    Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced completion of certification of its portfolio of cesium clocks to be compliant with the new G.811.1 recommendation (known as enhanced Primary Reference Clocks, or ePRC) from the International Telecommunication Union (ITU) for timing characteristics of enhanced primary reference clocks.

  4. M/A-COM Technology Solutions Announces New PIN Limiter Diode For S-Band And L-Band Applications 3/14/2013

    M/A-COM Technology Solutions Inc. (M/A-COM), a leading supplier of high performance analog semiconductor solutions, introduced recently a new Limiter Diode designed for passive limiter control circuits in L- and S- Band applications.

  5. RFMW Supports Skyworks Varactor Diodes 5/17/2013

    RFMW, Ltd. announces design and sales support for Skyworks diode products. The SMV1771-040LF is a surface mount, hyperabrupt, tuning varactor diode offering a high capacitance ratio and low series resistance.

  6. Microsemi's New 30 kW Three-Phase Vienna PFC Reference Design 5/22/2018

    Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new scalable 30-kilowatt (kW), three-phase Vienna power factor correction (PFC) topology reference designfeaturing its Silicon Carbide (SiC) diodes and MOSFETS.

  7. Rakon Introduces MEMS Technology To Frequency Control Products Portfolio 10/16/2012

    Rakon’s Managing Director, Brent Robinson says the company has looked into the technology for many years and the timing is now right to further diversify its offering to include MEMS oscillators.

  8. Northrop Grumman Creates Highest Power Single Chip Ka-Band Amplifier 5/18/2015

    Redondo Beach, CA — Northrop Grumman Corporation (NYSE: NOC) announced on Monday the highest power Gallium Nitride (GaN) monolithic microwave integrated circuit (MMIC) power amplifier ever produced at Ka-band. The company's Salah Din presented its paper on this achievement, entitled “High Power and High Efficiency Ka-band Power Amplifier,” at IMS on Wednesday, May 20. 

  9. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film 2/13/2013

    Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

  10. GLOBALFOUNDRIES Introduces New Automotive Platform For Connected Cars 10/12/2017

    GLOBALFOUNDRIES today unveiled AutoPro™, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.