News

  1. M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode 5/17/2013

    M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.

  2. NCSU Develops Metal Printing Technique For Flexible, Stretchable Electronics 12/20/2017

    Researchers from North Carolina State University have developed a new technique for directly printing metal circuits, creating flexible, stretchable electronics. The technique can use multiple metals and substrates and is compatible with existing manufacturing systems that employ direct printing technologies.

  3. Microsemi's New Cesium Atomic Clock Portfolio Compliant With New ITU Standards For EPRCs 4/5/2018

    Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced completion of certification of its portfolio of cesium clocks to be compliant with the new G.811.1 recommendation (known as enhanced Primary Reference Clocks, or ePRC) from the International Telecommunication Union (ITU) for timing characteristics of enhanced primary reference clocks.

  4. RFMW Offers High Speed Driver For Switching Applications 12/19/2017

    RFMW, Ltd. announces design and sales support for a high-speed FET driver from Peregrine Semiconductor. The PE29102 is designed to control the gates of external power devices such as GaN FETs providing switching transition speeds in the sub-nanosecond range for switching power supply applications up to 40MHz.

  5. “Atomristors” Hold Promise For Memory Storage, RF Switching 1/17/2018

    Engineers worldwide have been developing alternative ways to provide greater memory storage capacity on even smaller computer chips. Previous research into two-dimensional atomic sheets for memory storage has failed to uncover their potential — until now.

  6. EU, S. Korea Regulators OK Qualcomm Acquisition Of NXP; Deal Awaiting Chinese Approval 1/18/2018

    Qualcomm Incorporated recently announced that the European Commission and the Korea Fair Trade Commission (KFTC) authorized the acquisition by Qualcomm River Holdings B.V., an indirect wholly owned subsidiary of Qualcomm, of NXP Semiconductors N.V. The acquisition has now received 8 of the 9 approvals around the world, with China remaining.

  7. Microchip Technology Launches BitCloud 4.0 Software Development Kit 2/13/2017

    The industry’s first zigbee alliance certified zigbee platform with zigbee PRO and Green Power features (formerly known as zigbee 3.0) from a semiconductor company is now available from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions.

  8. IBM Research Alliance Builds New Transistor For 5nm Technology 6/5/2017

    IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips.

  9. New NIST Measurement Tool Is On Target For The Fast-Growing MEMS Industry 5/2/2013

    As markets for miniature, hybrid machines known as MEMS grow and diversify, the National Institute of Standards and Technology (NIST) has introduced a long-awaited measurement tool that will help growing numbers of device designers, manufacturers and customers to see eye to eye on eight dimensional and material property measurements that are key to device performance.

  10. Wuxi DSP Technologies To Release China's First IoT-Embedded AI Chip 12/1/2017

    The "2018 IoT and Embedded AI Chip Platform and Eco Strategy Conference" will be held on December 8, 2017 at Intercontinental Hotel Beijing Beichen as one of the sub-forums at the "2017 IoT Developers Conference".