MWC Americas -- Movandi, a venture-backed startup with a mission to revolutionize millimeter wave networks, today announced BeamX technology, a scalable RF front-end system solution.
Agilent Technologies Inc. recently announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs.
Anokiwave recently announced the first product in a new family of second generation 5G Silicon Quad Core ICs that enable 3GPP compliant base stations with the worldwide release of the 39 GHz AWMF-0156 IC.
Researchers from North Carolina State University have developed a new technique for directly printing metal circuits, creating flexible, stretchable electronics. The technique can use multiple metals and substrates and is compatible with existing manufacturing systems that employ direct printing technologies.
Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.
The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), recently announced the 18th annual event which will take place in Cocoa Beach Florida.
Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has released a new Broadband High IP3 Downconverter RFIC which operates from 700 to 3500 MHz.
PIN diodes are essential tools in the designer’s handbook. There are many resources that provide information about PIN diode characteristics and integration
IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips.
Redondo Beach, CA — Northrop Grumman Corporation (NYSE: NOC) announced on Monday the highest power Gallium Nitride (GaN) monolithic microwave integrated circuit (MMIC) power amplifier ever produced at Ka-band. The company's Salah Din presented its paper on this achievement, entitled “High Power and High Efficiency Ka-band Power Amplifier,” at IMS on Wednesday, May 20.
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