News

  1. Movandi Launches With RF Front End Technology For Emerging HF, mm-Wave Networks 9/6/2017

    MWC Americas -- Movandi, a venture-backed startup with a mission to revolutionize millimeter wave networks, today announced BeamX technology, a scalable RF front-end system solution.

  2. Anokiwave Introduces IC Supporting 3GPP-Compliant mmW 5G Equipment 2/20/2018

    Anokiwave recently announced the first product in a new family of second generation 5G Silicon Quad Core ICs that enable 3GPP compliant base stations with the worldwide release of the 39 GHz AWMF-0156 IC.

  3. NCSU Develops Metal Printing Technique For Flexible, Stretchable Electronics 12/20/2017

    Researchers from North Carolina State University have developed a new technique for directly printing metal circuits, creating flexible, stretchable electronics. The technique can use multiple metals and substrates and is compatible with existing manufacturing systems that employ direct printing technologies.

  4. Agilent Technologies Announces Host Adapter For MIPI Alliance DigRF v4 RFICs 2/21/2013

    Agilent Technologies Inc. recently announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs.

  5. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film 2/13/2013

    Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

  6. M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode 5/17/2013

    M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.

  7. 2017 IEEE Wireless and Microwave Technology Conference (WAMICON) Scheduled 10/12/2016

    The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), recently announced the 18th annual event which will take place in Cocoa Beach Florida.

  8. Microchip Technology Launches BitCloud 4.0 Software Development Kit 2/13/2017

    The industry’s first zigbee alliance certified zigbee platform with zigbee PRO and Green Power features (formerly known as zigbee 3.0) from a semiconductor company is now available from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions.

  9. LG Electronics, Here Technologies Partner On Next-Gen Telematics For Autonomous Vehicles 12/27/2017

    LG Electronics (LG) is partnering with HERE Technologies (HERE), a global provider of digital mapping and location services, to offer a next-generation telematics solution for autonomous vehicles.

  10. Diodes Added To SemiGen's RF Supply Center 10/3/2012

    SemiGen, Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the recent addition of key components to their RF Supply Center’s stockroom.