News

  1. Custom MMIC Announces New Fundamental Mixer, Offers Low Conversion Loss 4/11/2013

    Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits, has announced a new general purpose, double balanced fundamental mixer—the CMD178C3.

  2. Agilent Technologies Announces Host Adapter For MIPI Alliance DigRF v4 RFICs 2/21/2013

    Agilent Technologies Inc. recently announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs.

  3. Microchip Technology Launches BitCloud 4.0 Software Development Kit 2/13/2017

    The industry’s first zigbee alliance certified zigbee platform with zigbee PRO and Green Power features (formerly known as zigbee 3.0) from a semiconductor company is now available from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions.

  4. IBM Research Alliance Builds New Transistor For 5nm Technology 6/5/2017

    IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips.

  5. TowerJazz And Cavendish Kinetics Collaborate To Deliver High Volume Tunable RF MEMS Products For Fast Growing 4G Mobile Market 6/6/2013

    TowerJazz and Cavendish Kinetics, recently announced their collaboration to bring MEMS tunable RF solutions to the consumer mobile wireless market. The process technology combines the Cavendish NanoMech MEMS technology with the TowerJazz power CMOS process and custom RF interconnect in a single chip solution.

  6. Vectron International Announces Military Grade MEMS Oscillator 6/4/2013

    Vectron International, a leader in the design and manufacture of Precision Oscillators and Timing Solutions for Communication, Industrial, Military & Space applications, recently announces the release of the HT–MM900A Military Temperature Range MEMS Oscillator to support clock and timing requirements in especially demanding environmental conditions.

  7. Wuxi DSP Technologies To Release China's First IoT-Embedded AI Chip 12/1/2017

    The "2018 IoT and Embedded AI Chip Platform and Eco Strategy Conference" will be held on December 8, 2017 at Intercontinental Hotel Beijing Beichen as one of the sub-forums at the "2017 IoT Developers Conference".

  8. EU, S. Korea Regulators OK Qualcomm Acquisition Of NXP; Deal Awaiting Chinese Approval 1/18/2018

    Qualcomm Incorporated recently announced that the European Commission and the Korea Fair Trade Commission (KFTC) authorized the acquisition by Qualcomm River Holdings B.V., an indirect wholly owned subsidiary of Qualcomm, of NXP Semiconductors N.V. The acquisition has now received 8 of the 9 approvals around the world, with China remaining.

  9. ViaLite Launches Hyper-Wide Dynamic Range RF Over Fiber Link 3/1/2018

    High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.

  10. M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode 5/17/2013

    M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.