Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.
Mobile World Congress– Ethertronics, the leader in high performance antenna system solutions, recently announced the EC714 Wi-Fi Active Steering Front End Module (FEM), which provides a breakthrough 5 GHz Wi-Fi Front End Module solution for 802.11 ax/ac devices.
LG Electronics (LG) is partnering with HERE Technologies (HERE), a global provider of digital mapping and location services, to offer a next-generation telematics solution for autonomous vehicles.
Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has released a new Broadband High IP3 Downconverter RFIC which operates from 700 to 3500 MHz.
In IMS booth #3210, Custom MMIC, a developer of performance driven monolithic microwave integrated circuits (MMICs), is introducing three new devices from its growing MMIC IP/design library. CMD162 is a GaAs MMIC low-noise amplifier (LNA) chip for applications from 26 to 34 GHz. Optimized for 30 GHz satellite communications, the CMD162 boasts a typical noise figure of 1.7 dB with a small-signal gain of 22 dB and an output 1 dB compression point of +7 dB. This amplifier delivers high performance with high efficiency, reducing typical industry DC power dissipation for a device in this frequency band from approximately 340 mW down to 50 mW.
Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced completion of certification of its portfolio of cesium clocks to be compliant with the new G.811.1 recommendation (known as enhanced Primary Reference Clocks, or ePRC) from the International Telecommunication Union (ITU) for timing characteristics of enhanced primary reference clocks.
RFMW, Ltd. announces design and sales support for a high-speed FET driver from Peregrine Semiconductor. The PE29102 is designed to control the gates of external power devices such as GaN FETs providing switching transition speeds in the sub-nanosecond range for switching power supply applications up to 40MHz.
Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new scalable 30-kilowatt (kW), three-phase Vienna power factor correction (PFC) topology reference designfeaturing its Silicon Carbide (SiC) diodes and MOSFETS.
Researchers from North Carolina State University have developed a new technique for directly printing metal circuits, creating flexible, stretchable electronics. The technique can use multiple metals and substrates and is compatible with existing manufacturing systems that employ direct printing technologies.
Northrop Grumman Corporation has developed a line of gallium nitride (GaN) monolithic microwave integrated circuits (MMICs) for military and commercial uses.
|
|
|
|
|
|
|
|
|