News
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ViaLite Launches Hyper-Wide Dynamic Range RF Over Fiber Link
3/1/2018
High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.
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Microchip Technology Launches BitCloud 4.0 Software Development Kit
2/13/2017
The industry’s first zigbee alliance certified zigbee platform with zigbee PRO and Green Power features (formerly known as zigbee 3.0) from a semiconductor company is now available from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions.
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Wuxi DSP Technologies To Release China's First IoT-Embedded AI Chip
12/1/2017
The "2018 IoT and Embedded AI Chip Platform and Eco Strategy Conference" will be held on December 8, 2017 at Intercontinental Hotel Beijing Beichen as one of the sub-forums at the "2017 IoT Developers Conference".
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Anokiwave Introduces IC Supporting 3GPP-Compliant mmW 5G Equipment
2/20/2018
Anokiwave recently announced the first product in a new family of second generation 5G Silicon Quad Core ICs that enable 3GPP compliant base stations with the worldwide release of the 39 GHz AWMF-0156 IC.
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NCSU Develops Metal Printing Technique For Flexible, Stretchable Electronics
12/20/2017
Researchers from North Carolina State University have developed a new technique for directly printing metal circuits, creating flexible, stretchable electronics. The technique can use multiple metals and substrates and is compatible with existing manufacturing systems that employ direct printing technologies.
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Altum RF Announces Sales Representative Agreement With NWN, Inc.
10/20/2022
Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, announces a sales representative agreement with NWN, Inc. (NWN).