The industry’s first zigbee alliance certified zigbee platform with zigbee PRO and Green Power features (formerly known as zigbee 3.0) from a semiconductor company is now available from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions.
Researchers from North Carolina State University have developed a new technique for directly printing metal circuits, creating flexible, stretchable electronics. The technique can use multiple metals and substrates and is compatible with existing manufacturing systems that employ direct printing technologies.
Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), has added three new GaAs MMIC power amplifiers covering 5 to 11 GHz to their growing standard product library.
The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), recently announced the 18th annual event which will take place in Cocoa Beach Florida.
Rakon’s Managing Director, Brent Robinson says the company has looked into the technology for many years and the timing is now right to further diversify its offering to include MEMS oscillators.
RFMW, Ltd. announces design and sales support for Skyworks diode products. The SMV1771-040LF is a surface mount, hyperabrupt, tuning varactor diode offering a high capacitance ratio and low series resistance.
Vectron International, a leader in the design and manufacture of Precision Oscillators and Timing Solutions for Communication, Industrial, Military & Space applications, recently announces the release of the HT–MM900A Military Temperature Range MEMS Oscillator to support clock and timing requirements in especially demanding environmental conditions.
SemiGen, Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the recent addition of key components to their RF Supply Center’s stockroom.
Lansdale Semiconductor, Inc. recently announced the continued availability of the ML1350 and ML1490 Integrated Circuits (ICs). These IC’s were originally designed by Motorola/Freescale Semiconductor, Inc., and Lansdale has the single-source rights to globally market and manufacture them.
Engineers worldwide have been developing alternative ways to provide greater memory storage capacity on even smaller computer chips. Previous research into two-dimensional atomic sheets for memory storage has failed to uncover their potential — until now.
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