News

  1. New NIST Measurement Tool Is On Target For The Fast-Growing MEMS Industry 5/2/2013

    As markets for miniature, hybrid machines known as MEMS grow and diversify, the National Institute of Standards and Technology (NIST) has introduced a long-awaited measurement tool that will help growing numbers of device designers, manufacturers and customers to see eye to eye on eight dimensional and material property measurements that are key to device performance.

  2. M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode 5/17/2013

    M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.

  3. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film 2/13/2013

    Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

  4. ViaLite Launches Hyper-Wide Dynamic Range RF Over Fiber Link 3/1/2018

    High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.

  5. TowerJazz And Cavendish Kinetics Collaborate To Deliver High Volume Tunable RF MEMS Products For Fast Growing 4G Mobile Market 6/6/2013

    TowerJazz and Cavendish Kinetics, recently announced their collaboration to bring MEMS tunable RF solutions to the consumer mobile wireless market. The process technology combines the Cavendish NanoMech MEMS technology with the TowerJazz power CMOS process and custom RF interconnect in a single chip solution.

  6. LG Electronics, Here Technologies Partner On Next-Gen Telematics For Autonomous Vehicles 12/27/2017

    LG Electronics (LG) is partnering with HERE Technologies (HERE), a global provider of digital mapping and location services, to offer a next-generation telematics solution for autonomous vehicles.

  7. Microsemi's New 30 kW Three-Phase Vienna PFC Reference Design 5/22/2018

    Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new scalable 30-kilowatt (kW), three-phase Vienna power factor correction (PFC) topology reference designfeaturing its Silicon Carbide (SiC) diodes and MOSFETS.

  8. 2017 IEEE Wireless and Microwave Technology Conference (WAMICON) Scheduled 10/12/2016

    The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), recently announced the 18th annual event which will take place in Cocoa Beach Florida.

  9. Custom MMIC Announces New Fundamental Mixer, Offers Low Conversion Loss 4/11/2013

    Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits, has announced a new general purpose, double balanced fundamental mixer—the CMD178C3.

  10. Agilent Technologies' Advanced Design System Selected By Sivers IMA For Front-To-Back Silicon RFIC Implementation 6/19/2012

    Agilent Technologies Inc. recently announced that Sivers IMA, a leading European manufacturer of microwave products for telecommunications, industrial, and test and measurement applications, has selected Agilent’s Advanced Design System 2011 EDA platform for complete silicon-based RFIC/MMIC implementation.