News

  1. CHIPS For America Seeks Public Input On Financial Incentives, New Institutes For Semiconductor Manufacturing 10/13/2022

    National Institute of Standards and Technology (NIST) CHIPS for America initiative is seeking public input on two programs that aim to restore U.S. global leadership in semiconductor manufacturing.

  2. IBM Research Alliance Builds New Transistor For 5nm Technology 6/5/2017

    IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips.

  3. 2017 IEEE Wireless and Microwave Technology Conference (WAMICON) Scheduled 10/12/2016

    The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), recently announced the 18th annual event which will take place in Cocoa Beach Florida.

  4. Agilent Technologies Announces Host Adapter For MIPI Alliance DigRF v4 RFICs 2/21/2013

    Agilent Technologies Inc. recently announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs.

  5. Altum RF Introduces Industrialization Of 400-Watt S-band Power Amplifier MMIC 9/7/2022

    Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, introduces in collaboration with TNO a 400-Watt S-band power amplifier MMIC, using WIN Semiconductors’ NP45-11 technology.

  6. Altum RF Announces Sales Representative Agreement With NWN, Inc. 10/20/2022

    Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, announces a sales representative agreement with NWN, Inc. (NWN).

  7. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film 2/13/2013

    Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

  8. Microsemi's New Cesium Atomic Clock Portfolio Compliant With New ITU Standards For EPRCs 4/5/2018

    Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced completion of certification of its portfolio of cesium clocks to be compliant with the new G.811.1 recommendation (known as enhanced Primary Reference Clocks, or ePRC) from the International Telecommunication Union (ITU) for timing characteristics of enhanced primary reference clocks.

  9. Vectron International Announces Military Grade MEMS Oscillator 6/4/2013

    Vectron International, a leader in the design and manufacture of Precision Oscillators and Timing Solutions for Communication, Industrial, Military & Space applications, recently announces the release of the HT–MM900A Military Temperature Range MEMS Oscillator to support clock and timing requirements in especially demanding environmental conditions.

  10. “Atomristors” Hold Promise For Memory Storage, RF Switching 1/17/2018

    Engineers worldwide have been developing alternative ways to provide greater memory storage capacity on even smaller computer chips. Previous research into two-dimensional atomic sheets for memory storage has failed to uncover their potential — until now.