News

  1. 2017 IEEE Wireless and Microwave Technology Conference (WAMICON) Scheduled
    10/12/2016

    The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), recently announced the 18th annual event which will take place in Cocoa Beach Florida.

  2. Microsemi's New 30 kW Three-Phase Vienna PFC Reference Design
    5/22/2018

    Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new scalable 30-kilowatt (kW), three-phase Vienna power factor correction (PFC) topology reference designfeaturing its Silicon Carbide (SiC) diodes and MOSFETS.

  3. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film
    2/13/2013

    Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

  4. Custom MMIC Adds Four New Products To Its Growing Line Of Amplifiers
    4/25/2013

    Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), has added four new amplifiers in die form to its product family: the CMD164, 165, and 173 distributed amplifiers, and the CMD166 driver amplifier.

  5. M/A-COM Technology Solutions Announces New GaAs MMIC Doubler With Integrated Gain, Self-Biased Doubler And Driver Stages
    8/20/2012

    M/A-COM Technology Solutions Inc. (M/A-COM Tech), a leading supplier of high performance analog semiconductor solutions, introduced recently a GaAs MMIC Doubler for VSAT applications.

  6. Anokiwave Introduces IC Supporting 3GPP-Compliant mmW 5G Equipment
    2/20/2018

    Anokiwave recently announced the first product in a new family of second generation 5G Silicon Quad Core ICs that enable 3GPP compliant base stations with the worldwide release of the 39 GHz AWMF-0156 IC.

  7. IBM Research Alliance Builds New Transistor For 5nm Technology
    6/5/2017

    IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips.

  8. Movandi Launches With RF Front End Technology For Emerging HF, mm-Wave Networks
    9/6/2017

    MWC Americas -- Movandi, a venture-backed startup with a mission to revolutionize millimeter wave networks, today announced BeamX technology, a scalable RF front-end system solution.

  9. Diodes Added To SemiGen’s RF Supply Center
    10/3/2012

    SemiGen, Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the recent addition of key components to their RF Supply Center’s stockroom.

  10. Northrop Grumman Creates Highest Power Single Chip Ka-Band Amplifier
    5/18/2015

    Redondo Beach, CA — Northrop Grumman Corporation (NYSE: NOC) announced on Monday the highest power Gallium Nitride (GaN) monolithic microwave integrated circuit (MMIC) power amplifier ever produced at Ka-band. The company's Salah Din presented its paper on this achievement, entitled “High Power and High Efficiency Ka-band Power Amplifier,” at IMS on Wednesday, May 20.