News

1. Microsemi's New 30 kW Three-Phase Vienna PFC Reference Design 5/22/2018

   Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new scalable 30-kilowatt (kW), three-phase Vienna power factor correction (PFC) topology reference designfeaturing its Silicon Carbide (SiC) diodes and MOSFETS.

2. RFMW Supports Skyworks Varactor Diodes 5/17/2013

   RFMW, Ltd. announces design and sales support for Skyworks diode products. The SMV1771-040LF is a surface mount, hyperabrupt, tuning varactor diode offering a high capacitance ratio and low series resistance.

3. Ethertronics Debuts 802.11ax Wi-Fi Front End Module With Active Steering Technology 2/27/2018

   Mobile World Congress– Ethertronics, the leader in high performance antenna system solutions, recently announced the EC714 Wi-Fi Active Steering Front End Module (FEM), which provides a breakthrough 5 GHz Wi-Fi Front End Module solution for 802.11 ax/ac devices.

4. TowerJazz And Cavendish Kinetics Collaborate To Deliver High Volume Tunable RF MEMS Products For Fast Growing 4G Mobile Market 6/6/2013

   TowerJazz and Cavendish Kinetics, recently announced their collaboration to bring MEMS tunable RF solutions to the consumer mobile wireless market. The process technology combines the Cavendish NanoMech MEMS technology with the TowerJazz power CMOS process and custom RF interconnect in a single chip solution.

5. Anokiwave Introduces IC Supporting 3GPP-Compliant mmW 5G Equipment 2/20/2018

   Anokiwave recently announced the first product in a new family of second generation 5G Silicon Quad Core ICs that enable 3GPP compliant base stations with the worldwide release of the 39 GHz AWMF-0156 IC.

6. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film 2/13/2013

   Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

7. Microsemi's New Cesium Atomic Clock Portfolio Compliant With New ITU Standards For EPRCs 4/5/2018

   Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced completion of certification of its portfolio of cesium clocks to be compliant with the new G.811.1 recommendation (known as enhanced Primary Reference Clocks, or ePRC) from the International Telecommunication Union (ITU) for timing characteristics of enhanced primary reference clocks.

8. Altum RF Announces Sales Representative Agreement With NWN, Inc. 10/20/2022

   Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, announces a sales representative agreement with NWN, Inc. (NWN).

9. Movandi Launches With RF Front End Technology For Emerging HF, mm-Wave Networks 9/6/2017

   MWC Americas -- Movandi, a venture-backed startup with a mission to revolutionize millimeter wave networks, today announced BeamX technology, a scalable RF front-end system solution.

10. Custom MMIC Adds Four New Products To Its Growing Line Of Amplifiers 4/25/2013

    Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), has added four new amplifiers in die form to its product family: the CMD164, 165, and 173 distributed amplifiers, and the CMD166 driver amplifier.