News

  1. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film 2/13/2013

    Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

  2. GLOBALFOUNDRIES Introduces New Automotive Platform For Connected Cars 10/12/2017

    GLOBALFOUNDRIES today unveiled AutoPro™, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.

  3. ViaLite Launches Hyper-Wide Dynamic Range RF Over Fiber Link 3/1/2018

    High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.

  4. SiTime And Intel Announce Collaboration On MEMS Timing For 5G 7/24/2018

    SiTime Corporation, a leading provider of MEMS timing, and Intel today announced a collaboration to work together on integrating timing solutions for Intel's 5G multi-mode radio modems, with additional applicability to Intel LTE, millimeter-wave wireless, Wi-Fi, Bluetooth, and GNSS solutions.

  5. RFMW Supports Skyworks Varactor Diodes 5/17/2013

    RFMW, Ltd. announces design and sales support for Skyworks diode products. The SMV1771-040LF is a surface mount, hyperabrupt, tuning varactor diode offering a high capacitance ratio and low series resistance.

  6. LG Electronics, Here Technologies Partner On Next-Gen Telematics For Autonomous Vehicles 12/27/2017

    LG Electronics (LG) is partnering with HERE Technologies (HERE), a global provider of digital mapping and location services, to offer a next-generation telematics solution for autonomous vehicles.

  7. M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode 5/17/2013

    M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.

  8. 2017 IEEE Wireless and Microwave Technology Conference (WAMICON) Scheduled 10/12/2016

    The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), recently announced the 18th annual event which will take place in Cocoa Beach Florida.

  9. Agilent Technologies' Advanced Design System Selected By Sivers IMA For Front-To-Back Silicon RFIC Implementation 6/19/2012

    Agilent Technologies Inc. recently announced that Sivers IMA, a leading European manufacturer of microwave products for telecommunications, industrial, and test and measurement applications, has selected Agilent’s Advanced Design System 2011 EDA platform for complete silicon-based RFIC/MMIC implementation.

  10. Altum RF To Showcase Products And Expertise At EuMW 2022 9/14/2022

    Join Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, at the European Microwave Week (EuMW) 2022 event to be held in Milan.