News

1. LG Electronics, Here Technologies Partner On Next-Gen Telematics For Autonomous Vehicles 12/27/2017

   LG Electronics (LG) is partnering with HERE Technologies (HERE), a global provider of digital mapping and location services, to offer a next-generation telematics solution for autonomous vehicles.

2. Anokiwave Introduces IC Supporting 3GPP-Compliant mmW 5G Equipment 2/20/2018

   Anokiwave recently announced the first product in a new family of second generation 5G Silicon Quad Core ICs that enable 3GPP compliant base stations with the worldwide release of the 39 GHz AWMF-0156 IC.

3. M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode 5/17/2013

   M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.

4. Custom MMIC Announces New Fundamental Mixer, Offers Low Conversion Loss 4/11/2013

   Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits, has announced a new general purpose, double balanced fundamental mixer—the CMD178C3.

5. Altum RF Showcases Products and Expertise at IMS 2022 6/8/2022

   Join Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, at the International Microwave Symposium (IMS) 2022 event to be held in Denver, Colorado.

6. TowerJazz And Cavendish Kinetics Collaborate To Deliver High Volume Tunable RF MEMS Products For Fast Growing 4G Mobile Market 6/6/2013

   TowerJazz and Cavendish Kinetics, recently announced their collaboration to bring MEMS tunable RF solutions to the consumer mobile wireless market. The process technology combines the Cavendish NanoMech MEMS technology with the TowerJazz power CMOS process and custom RF interconnect in a single chip solution.

7. “Atomristors” Hold Promise For Memory Storage, RF Switching 1/17/2018

   Engineers worldwide have been developing alternative ways to provide greater memory storage capacity on even smaller computer chips. Previous research into two-dimensional atomic sheets for memory storage has failed to uncover their potential — until now.

8. Custom MMIC Unveils Three New LNA MMICs At IMS 2012 6/20/2012

   In IMS booth #3210, Custom MMIC, a developer of performance driven monolithic microwave integrated circuits (MMICs), is introducing three new devices from its growing MMIC IP/design library. CMD162 is a GaAs MMIC low-noise amplifier (LNA) chip for applications from 26 to 34 GHz. Optimized for 30 GHz satellite communications, the CMD162 boasts a typical noise figure of 1.7 dB with a small-signal gain of 22 dB and an output 1 dB compression point of +7 dB. This amplifier delivers high performance with high efficiency, reducing typical industry DC power dissipation for a device in this frequency band from approximately 340 mW down to 50 mW.

9. Agilent Technologies' Advanced Design System Selected By Sivers IMA For Front-To-Back Silicon RFIC Implementation 6/19/2012

   Agilent Technologies Inc. recently announced that Sivers IMA, a leading European manufacturer of microwave products for telecommunications, industrial, and test and measurement applications, has selected Agilent’s Advanced Design System 2011 EDA platform for complete silicon-based RFIC/MMIC implementation.

10. SiTime And Intel Announce Collaboration On MEMS Timing For 5G 7/24/2018

    SiTime Corporation, a leading provider of MEMS timing, and Intel today announced a collaboration to work together on integrating timing solutions for Intel's 5G multi-mode radio modems, with additional applicability to Intel LTE, millimeter-wave wireless, Wi-Fi, Bluetooth, and GNSS solutions.