News

1. ViaLite Launches Hyper-Wide Dynamic Range RF Over Fiber Link 3/1/2018

   High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.

2. Ethertronics Debuts 802.11ax Wi-Fi Front End Module With Active Steering Technology 2/27/2018

   Mobile World Congress– Ethertronics, the leader in high performance antenna system solutions, recently announced the EC714 Wi-Fi Active Steering Front End Module (FEM), which provides a breakthrough 5 GHz Wi-Fi Front End Module solution for 802.11 ax/ac devices.

3. SiTime And Intel Announce Collaboration On MEMS Timing For 5G 7/24/2018

   SiTime Corporation, a leading provider of MEMS timing, and Intel today announced a collaboration to work together on integrating timing solutions for Intel's 5G multi-mode radio modems, with additional applicability to Intel LTE, millimeter-wave wireless, Wi-Fi, Bluetooth, and GNSS solutions.

4. M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode 5/17/2013

   M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.

5. Dialog Semiconductor Adopts Keysight Technologies' Device Characterization, Modeling Software Suite 5/11/2015

   Dialog Semiconductor has adopted Keysight Technology Inc.'s suite of device-modeling software to perform foundry technology characterization, model validation, model customization and enhancement.

6. Custom MMIC Adds Four New Products To Its Growing Line Of Amplifiers 4/25/2013

   Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), has added four new amplifiers in die form to its product family: the CMD164, 165, and 173 distributed amplifiers, and the CMD166 driver amplifier.

7. Agilent Technologies’ Advanced Design System Selected By Sivers IMA For Front-To-Back Silicon RFIC Implementation 6/19/2012

   Agilent Technologies Inc. recently announced that Sivers IMA, a leading European manufacturer of microwave products for telecommunications, industrial, and test and measurement applications, has selected Agilent’s Advanced Design System 2011 EDA platform for complete silicon-based RFIC/MMIC implementation.

8. “Atomristors” Hold Promise For Memory Storage, RF Switching 1/17/2018

   Engineers worldwide have been developing alternative ways to provide greater memory storage capacity on even smaller computer chips. Previous research into two-dimensional atomic sheets for memory storage has failed to uncover their potential — until now.

9. Narda Announces New Booklet For Selecting the Best PIN Diode Control Product for an Application 1/18/2013

   PIN diodes are essential tools in the designer’s handbook. There are many resources that provide information about PIN diode characteristics and integration

10. Wuxi DSP Technologies To Release China's First IoT-Embedded AI Chip 12/1/2017

    The "2018 IoT and Embedded AI Chip Platform and Eco Strategy Conference" will be held on December 8, 2017 at Intercontinental Hotel Beijing Beichen as one of the sub-forums at the "2017 IoT Developers Conference".