News
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UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film
2/13/2013
Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.
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MMIC Amplifiers Offer High Output Power And Positive Bias
12/19/2012
Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), has added three new GaAs MMIC power amplifiers covering 5 to 11 GHz to their growing standard product library.
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M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode
5/17/2013
M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.
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New NIST Measurement Tool Is On Target For The Fast-Growing MEMS Industry
5/2/2013
As markets for miniature, hybrid machines known as MEMS grow and diversify, the National Institute of Standards and Technology (NIST) has introduced a long-awaited measurement tool that will help growing numbers of device designers, manufacturers and customers to see eye to eye on eight dimensional and material property measurements that are key to device performance.
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CHIPS For America Seeks Public Input On Financial Incentives, New Institutes For Semiconductor Manufacturing
10/13/2022
National Institute of Standards and Technology (NIST) CHIPS for America initiative is seeking public input on two programs that aim to restore U.S. global leadership in semiconductor manufacturing.
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EU, S. Korea Regulators OK Qualcomm Acquisition Of NXP; Deal Awaiting Chinese Approval
1/18/2018
Qualcomm Incorporated recently announced that the European Commission and the Korea Fair Trade Commission (KFTC) authorized the acquisition by Qualcomm River Holdings B.V., an indirect wholly owned subsidiary of Qualcomm, of NXP Semiconductors N.V. The acquisition has now received 8 of the 9 approvals around the world, with China remaining.
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ViaLite Launches Hyper-Wide Dynamic Range RF Over Fiber Link
3/1/2018
High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.
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Rakon Introduces MEMS Technology To Frequency Control Products Portfolio
10/16/2012
Rakon’s Managing Director, Brent Robinson says the company has looked into the technology for many years and the timing is now right to further diversify its offering to include MEMS oscillators.
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SiTime And Intel Announce Collaboration On MEMS Timing For 5G
7/24/2018
SiTime Corporation, a leading provider of MEMS timing, and Intel today announced a collaboration to work together on integrating timing solutions for Intel's 5G multi-mode radio modems, with additional applicability to Intel LTE, millimeter-wave wireless, Wi-Fi, Bluetooth, and GNSS solutions.
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Custom MMIC Adds Four New Products To Its Growing Line Of Amplifiers
4/25/2013
Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), has added four new amplifiers in die form to its product family: the CMD164, 165, and 173 distributed amplifiers, and the CMD166 driver amplifier.