As markets for miniature, hybrid machines known as MEMS grow and diversify, the National Institute of Standards and Technology (NIST) has introduced a long-awaited measurement tool that will help growing numbers of device designers, manufacturers and customers to see eye to eye on eight dimensional and material property measurements that are key to device performance.
RFMW, Ltd. announces design and sales support for Skyworks diode products. The SMV1771-040LF is a surface mount, hyperabrupt, tuning varactor diode offering a high capacitance ratio and low series resistance.
Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.
High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.
The industry’s first zigbee alliance certified zigbee platform with zigbee PRO and Green Power features (formerly known as zigbee 3.0) from a semiconductor company is now available from Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions.
Qualcomm Incorporated recently announced that the European Commission and the Korea Fair Trade Commission (KFTC) authorized the acquisition by Qualcomm River Holdings B.V., an indirect wholly owned subsidiary of Qualcomm, of NXP Semiconductors N.V. The acquisition has now received 8 of the 9 approvals around the world, with China remaining.
IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips.
PIN diodes are essential tools in the designer’s handbook. There are many resources that provide information about PIN diode characteristics and integration
Microsemi Corporation will feature 13 new products from its radio frequency (RF), microwave and millimeter wave integrated circuits (ICs), modules, monolithic microwave integrated circuits (MMICs) and subsystem portfolio at the 2015 IEEE MTT-S International Microwave Symposium (IMS2015) and Exhibition at the Phoenix Convention Center in Phoenix, Arizona May 17-22, 2015.
GLOBALFOUNDRIES today unveiled AutoPro™, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.
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