News

1. Altum RF Introduces Industrialization Of 400-Watt S-band Power Amplifier MMIC 9/7/2022

   Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, introduces in collaboration with TNO a 400-Watt S-band power amplifier MMIC, using WIN Semiconductors’ NP45-11 technology.

2. Altum RF To Showcase Products And Expertise At EuMW 2022 9/14/2022

   Join Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, at the European Microwave Week (EuMW) 2022 event to be held in Milan.

3. EU, S. Korea Regulators OK Qualcomm Acquisition Of NXP; Deal Awaiting Chinese Approval 1/18/2018

   Qualcomm Incorporated recently announced that the European Commission and the Korea Fair Trade Commission (KFTC) authorized the acquisition by Qualcomm River Holdings B.V., an indirect wholly owned subsidiary of Qualcomm, of NXP Semiconductors N.V. The acquisition has now received 8 of the 9 approvals around the world, with China remaining.

4. RFMW Supports Skyworks Varactor Diodes 5/17/2013

   RFMW, Ltd. announces design and sales support for Skyworks diode products. The SMV1771-040LF is a surface mount, hyperabrupt, tuning varactor diode offering a high capacitance ratio and low series resistance.

5. Altum RF Showcases Products and Expertise at IMS 2022 6/8/2022

   Join Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, at the International Microwave Symposium (IMS) 2022 event to be held in Denver, Colorado.

6. Ethertronics Debuts 802.11ax Wi-Fi Front End Module With Active Steering Technology 2/27/2018

   Mobile World Congress– Ethertronics, the leader in high performance antenna system solutions, recently announced the EC714 Wi-Fi Active Steering Front End Module (FEM), which provides a breakthrough 5 GHz Wi-Fi Front End Module solution for 802.11 ax/ac devices.

7. GLOBALFOUNDRIES Introduces New Automotive Platform For Connected Cars 10/12/2017

   GLOBALFOUNDRIES today unveiled AutoPro™, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.

8. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film 2/13/2013

   Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

9. M/A-COM Technology Solutions Announces New Solder-Able Flip Chip PIN Diode 5/17/2013

   M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance analog semiconductor solutions, recently announced a new broadband general purpose amplifier for Multi-market applications.

10. ViaLite Launches Hyper-Wide Dynamic Range RF Over Fiber Link 3/1/2018

    High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.