News

1. IBM Research Alliance Builds New Transistor For 5nm Technology 6/5/2017

   IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips.

2. UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film 2/13/2013

   Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

3. 2017 IEEE Wireless and Microwave Technology Conference (WAMICON) Scheduled 10/12/2016

   The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (WAMICON), recently announced the 18th annual event which will take place in Cocoa Beach Florida.

4. Microsemi's New 30 kW Three-Phase Vienna PFC Reference Design 5/22/2018

   Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new scalable 30-kilowatt (kW), three-phase Vienna power factor correction (PFC) topology reference designfeaturing its Silicon Carbide (SiC) diodes and MOSFETS.

5. Microsemi's New Cesium Atomic Clock Portfolio Compliant With New ITU Standards For EPRCs 4/5/2018

   Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced completion of certification of its portfolio of cesium clocks to be compliant with the new G.811.1 recommendation (known as enhanced Primary Reference Clocks, or ePRC) from the International Telecommunication Union (ITU) for timing characteristics of enhanced primary reference clocks.

6. NCSU Develops Metal Printing Technique For Flexible, Stretchable Electronics 12/20/2017

   Researchers from North Carolina State University have developed a new technique for directly printing metal circuits, creating flexible, stretchable electronics. The technique can use multiple metals and substrates and is compatible with existing manufacturing systems that employ direct printing technologies.

7. Wuxi DSP Technologies To Release China's First IoT-Embedded AI Chip 12/1/2017

   The "2018 IoT and Embedded AI Chip Platform and Eco Strategy Conference" will be held on December 8, 2017 at Intercontinental Hotel Beijing Beichen as one of the sub-forums at the "2017 IoT Developers Conference".

8. RFMW Offers High Speed Driver For Switching Applications 12/19/2017

   RFMW, Ltd. announces design and sales support for a high-speed FET driver from Peregrine Semiconductor. The PE29102 is designed to control the gates of external power devices such as GaN FETs providing switching transition speeds in the sub-nanosecond range for switching power supply applications up to 40MHz.

9. Altum RF To Showcase Products And Expertise At EuMW 2022 9/14/2022

   Join Altum RF, a supplier of high-performance RF to millimeter-wave semiconductor solutions for next generation markets and applications, at the European Microwave Week (EuMW) 2022 event to be held in Milan.

10. ViaLite Launches Hyper-Wide Dynamic Range RF Over Fiber Link 3/1/2018

    High Throughput Satellites (HTS) are capable of transmitting data over a hundred times faster than conventional Fixed Satellite Service (FSS) satellites and this higher throughput needs more dynamic range within the ground segment. Addressing this need, ViaLite has launched the new L-Band HTS – HWDR RF over fiber link.