Current Headlines

  1. Telewave Launches Advanced Indoor Distributed Antenna System – iDAS Appeal™
    3/5/2019

    Telewave, Inc., a leading provider of premium quality RF and wireless systems equipment, today announced its introduction of iDAS Appeal™, an indoor Distributed Antenna System (iDAS) product family. Incorporating advanced materials and RF engineering expertise, Telewave’s iDAS offers a low PIM (passive intermodulation), durable, efficient and economical solution.

  2. First Field Instrument Providing 3D Indoor And Outdoor Coverage Mapping For 5G NR Introduced By Anritsu
    3/5/2019

    Anritsu Company and TRX Systems introduce the industry's first field solution that provides 3D indoor and outdoor coverage mapping for 5G New Radio (5G NR) that integrates the Field Master Pro™ MS2090A RF handheld spectrum analyzer with the MA8100A TRX NEON® Signal Mapper.

  3. Sinclair Technologies Announces The TRANSeon Series Of Mobile Antennas For Transportation
    3/5/2019

    Sinclair Technologies ("Sinclair" or "the Company"), a division of Norsat International, and a leading provider of customizable land mobile radio communication solutions, today announced the launch of the TRANSeon™ series of mobile antennas for highly demanding transportation applications.

  4. Pentek's Jade Architecture Digital I/O XMC Module Now Available
    3/4/2019

    Pentek, Inc., today introduced the newest member of the Jade" family of data converter XMC modules. The Model 71810 is based on the Xilinx Kintex Ultrascale FPGA and features LVDS digital I/O to meet custom requirements. The Model 71810 routes 38 pairs of LVDS connections from the FPGA to an 80-pin connector on the front panel. When mounted on a compatible single board computer or other XMC carrier, the Model 71810 provides a fully customizable I/O signal status and control interface.

  5. MACOM Expands 400G PAM-4 Chipset Solution For Data Center Optical Connectivity With New Low Noise Transimpedance Amplifiers
    3/4/2019

    MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor solutions, recently announced availability of production versions of its four-channel (4 x 100G) 56/106 Gbit PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G optical modules targeting Cloud Data Center applications.

  6. Quantenna Delivers Multi-Gig Network Capacity Using Multi-User MIMO
    3/4/2019

    Quantenna Communications, Inc. (NASDAQ: QTNA) has set a new bar for Wi-Fi network performance by achieving over 2Gbit/s total throughput. This was attained by connecting multiple laptops with commercially available Intel® Wireless-AC 9260 2x2AC MIMO wireless modems to a Quantenna-based 8x8 MIMO access point and utilizing the latest Wi-Fi features such as multi-user MIMO (MU-MIMO).

  7. New Technology Is A Generational Leap In Aircrew Protection From Radio Frequency Threats
    3/4/2019

    Northrop Grumman Corporation has received an award from the U.S. Army to develop the AN/APR-39E(V)2, the next generation of radar threat warning sensors.

  8. Qualcomm Signs Agreement With EURECOM, IMT And France Brevets To Support Tech Research For Future 5G Standards
    3/4/2019

    France Brevets, IMT and EURECOM recently announced a joint agreement with Qualcomm Incorporated to foster research into new technologies for future 5G standards. Under the terms of the agreement, Qualcomm will contribute funding and standards expertise to support wireless communications research by EURECOM and its partner organization Institut Mines-Télécom (IMT), while France Brevets will provide support in the area of intellectual property strategy.

  9. Teledyne e2v Releases First Military Qualified Arm Based Processor For Hi-Reliability Applications
    3/4/2019

    Teledyne e2v, an aerospace qualified manufacturer of advanced semiconductors, has qualified and released the first upscreened processor from NXP’s new Layerscape Series, the LS1046A, to operate at -55°C to 125°C.

  10. Industry's First Integrated Quad- And Dual-Channel RF-Sampling Transceivers Enable Multiantenna Wideband Systems
    3/4/2019

    Texas Instruments (TI) (NASDAQ: TXN) today introduced two new RF-sampling transceivers that are the first in the industry to integrate four analog-to-digital converters (ADCs) and four digital-to-analog converters (DACs) in a single chip.