Newsletter | February 19, 2026

02.19.26 -- MIMO And Array Design For 5G, Head-To-Head Coaxial Interconnect Vs. OTA Testing For 5G & More

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FROM THE EDITOR

Understanding The Promise And Potential Of 6G Technology

6G is still in a phase of applied research and technology trials and is not expected to be commercialized until around 2030. But that doesn’t mean important steps toward its rollout aren’t happening now.

SPOTLIGHT ON 5G/6G/WIFI & IOT

MIMO And Array Design For 5G

XFdtd and Wireless InSite streamline 5G antenna design, modeling coupling, beam steering, and multipath effects to predict real-world throughput and device performance accurately.

5G Mobile Network Testing Using A Passive Network Scanner

Explore the importance of passive mobile network testing for the technology and deployment verification of 5G NR in the field and its future development.

INDUSTRY INSIGHTS

Head-To-Head Coaxial Interconnect Vs. OTA Testing For 5G

Over-the-air testing transforms wireless validation, enabling innovative measurement of advanced antenna systems and array technologies previously impossible with traditional wired test methods.

mMIMO Enables 5G, GaN On SiC Enables mMIMO

Massive MIMO dramatically expands antenna counts, while GaN-on-SiC technology delivers the power density and thermal performance needed to enable scalable 5G mMIMO deployments.

MXPM PCB Socket Assembly

Discover the assembly of high-performance MXPM PCB sockets, covering footprint optimization, soldering techniques, plating, and component placement.

MOST POPULAR NEWS

GuRu Wireless, Uniquest, And Arion Advance Persistent sUAS For Korean Defense

BroadWave Technologies Debuted A 100-Watt Conduction Cooled Fixed Attenuator Series

RTX BBN Leads Real-Time 5G, Defense Radar Spectrum Coexistence Demo

Richardson Electronics, Ltd. Strengthens RF & Microwave Product Portfolio

Wireless Broadband Alliance Targets Smart-Living Barriers In MDUs

Terrestar Launches Nationwide Hybrid Satellite IoT Service with Mavenir RAN/Core

Rakuten Mobile Collaborates With Intel To Forge AI-First vRAN Future

Allen-Vanguard Enters South America With Multi-Million ECM Order

Samtec Showcases 224 And 448 Gbps Interconnect Solutions At DesignCon 2026

Mtron Receives $4M Follow-On Award On Major U.S. Defense Production Contract

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2.0 To 8.0 GHz, 500 W Solid-State High-Power Amplifier

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Exodus Advanced Communications

5G Massive IoT System-In-Package

The SKY66431-11 is a multi-band multi-chip System-in Package (SiP) supporting 5G Massive IoT (LTE-M/NB-IoT) platforms.

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5G Microwave Upconverter/Downconverter

The ADMV1139 is an silicon on isolator (SOI), microwave, upconverter and downconverter optimized for 5G radio designs operating in the 37 GHz to 48.2 GHz frequency range.

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Analog Devices

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