Latest Headlines

1. BroadWave Technologies Launched A N Female To N Female Fixed Attenuator Series 6/17/2026

   Model series 352-343-XXX^* is a line of 50 Ohm fixed attenuators rated 1-Watt average power.

2. Marconi Technologies Selected To Deliver Orion X650 Tactical Radios To Polish Military 6/16/2026

   Marconi Technologies and Polish defense integrator Enamor International have been selected to deliver Orion X650 high-capacity MANET radios to the Polish military, providing a survivable, mobile backhaul for 5G-enabled communications. Multi-year deliveries will begin later this year.

3. Murata Collaborates With Synopsys To Provide Simulation Models Through Ansys Electromagnetic And Thermal Analysis Tools 6/16/2026

   Murata Manufacturing Co., Ltd. announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata.

4. u-blox Announces MAYA-W5 And NORA-W5, Its New Reliable Wi-Fi 6 Modules For Cost-Conscious Applications 6/16/2026

   u-blox, a global leader in positioning and short-range communication technologies for automotive, industrial, and consumer markets, today announced MAYA-W5 and NORA-W5, two new Wi-Fi 6 module families designed to bring secure, reliable wireless connectivity to the next-generation IoT devices.

5. Godspeed-Backed GALT Aerospace Announces Strategic Partnership With North Star Scientific 6/15/2026

   GALT Aerospace (“GALT,”), a leading defense innovator delivering warfighter centric command, control, and communications (“C3”) solutions for airborne systems, today announced the acquisition of North Star Scientific Corporation (“NSS” or the “Company”), a premier designer & manufacturer of defense electronics products focused on providing high-reliability communications, radar, and radio frequency (“RF”) systems in support of command & control, electronic sensing, and airborne early warning & control (“AEW&C”) missions.

6. Molex Expands Award-Winning AirBorn SInergy Modular High-Speed Hybrid Connectors With New High-Power Modules For All-In-One Connectivity 6/15/2026

   Molex, a global electronics leader and connectivity innovator, announces a significant expansion of its award-winning AirBorn SInergy Modular High-Speed Hybrid Connectors.

7. CEA Leti Advances European FD-SOI Innovation With GlobalFoundries' Collaboration in the FAMES Pilot Line 6/11/2026

   CEA‑Leti, a leading European research institute for microelectronics, today reaffirmed its long‑standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two decades of joint work on fully depleted silicon‑on‑insulator (FD‑SOI) technology and reinforcing Europe's leadership in energy‑efficient, sovereign semiconductors.

8. Viasat Selected By U.S. Space Force To Deliver Dual-Band Satellite System Under The Protected Tactical SATCOM-Global (PTS-G) Program Swarm 1 Delivery Order 6/11/2026

   Viasat, Inc. (NASDAQ: VSAT), a global leader in satellite communications, today announced it was awarded a prime contract by the U.S. Space Force’s (USSF) Space Systems Command (SSC) to build, launch and deliver the first of a proliferated fleet of small, maneuverable geosynchronous Earth orbit (GEO) satellites under the Protected Tactical SATCOM-Global (PTS-G) program.

9. The RAN Gets Smarter: Ericsson Puts AI Where It Matters 6/11/2026

   As AI-driven services grow, mobile networks require higher performance and smarter automation. Ericsson today introduced AI in RAN, a software subscription that brings telco-grade AI models into basebands and radios to boost efficiency, performance, and energy savings.

10. Imec Unlocks System-Level III-V Chiplet Integration On Si-CMOS By Advancing Its 300mm RF Silicon Interposer Platform With High-Density MIMCAPs, Passive Modeling, And Laser-Assisted Bonding 6/11/2026

    Imec, a world-leading research and innovation hub in advanced semiconductor technologies, is evolving its 300mm RF silicon interposer into a system-level platform for the heterogeneous integration of III-V chiplets on Si-CMOS.