RF Military Electronics Featured Articles

  1. Testing Modern Radar System Signals: A Primer

    The demands placed on modern radars create challenges for both the radar designer and test engineer. Advanced radar systems require greater precision to measure narrower pulse widths and/or to examine intra-pulse behavior with finer resolution, including rise/fall edge effects or the profile within a pulse compression signal. In order to best understand the complexity of testing today’s radar designs, it is good to first review some basic applications of radar systems and the fundamentals of pulse measurements. By Walt Strickler, senior product manager, Anritsu Company

  2. Smart Microwave Sensors For Critical Site Protection

    Miniaturized, high-performance smart radar sensors with multiple features and operating mode capabilities can easily and effectively protect large open sites by detecting and tracking moving or stationary targets over a 360° azimuth.

  3. The Expanding Role Of GaN HEMT Devices In Military Electronics Design

    In the early 2000s, military designers developing the next generation of high-frequency, high-power amplifiers for radar, communications and EW equipment had reached the performance limits of conventional technologies, namely Traveling Wave Tubes (TWTs), silicon Laterally Diffused Metal Oxide Semiconductor (Si LDMOS) transistors, and gallium arsenide (GaAs) MESFETs. By Tom Dekker, Cree

  4. Fundamentals And Applications Of Polyimide In 3D Thin Film Multilayer Circuitry

    Today, the cost and complexity of all platforms and systems in military and defense technologies are being challenged by the need for high functionality in smaller but less expensive architecture, especially in light of current national budget challenges. By Michael D. Casper, UltraSource, Inc.

  5. For Better SWaP, Choose GaN

    Today’s GaN‐based products are rising to the challenge of rapidly evolving demands for size, reliability, linearity, power density and energy efficiency, by providing RF system engineers with the flexibility to achieve significantly higher power and efficiency, with lower part count, board space and resultant cost.

  6. Detection And Location Of Suspicious RF Traffic — A Geolocation Primer

    Today, more than ever before, monitoring RF spectrum activity in a given geographical area is becoming a necessity rather than a choice. Applications for examining the RF environment are almost boundless, and include regulatory enforcement, corporate security, defense, counter espionage and cyber security. By Malcolm Levy, Vice President, Americas, CRFS Inc., California

  7. Cognitive Tactical Communication Networks

    Cognitive Radio (CR ) has been an intensive topic of research in recent years. Its main applications range from the utilization of TV white spaces to interoperability between large communication systems in all layers.

  8. Advances In Radar Simulation And Design

    Advances in modern radar systems include specialized active antennas, microwave circuits and devices, agile beam steering and shape, and digital space-time signal processing.  While the pace of radar technology continues to march forward, two fundamentals remain constant. The first is that the electromagnetic properties of antennas, radomes, and the installation platform are governed by the underlying and unwavering physics. By Lawrence Williams, PhD., Director Product Management, Matthew Commens, PhD., Product Manager, HFSS, and Steve Rousselle, Technical Director, ANSYS, Inc.

  9. A 13-kW S-Band GaN Power Amplifier Design For Radar Applications

    The introduction of GaN as a solid state semiconductor material has enabled the manufacture of high-power, efficient amplifiers in a small volume. This paper presents details of the design and performance data for the VSS3607 amplifier, including results from a 1000-hour life test. 

  10. White Paper: Airstrip™ — An Innovative Transmission Line Technology In Support Of Hi-Rel Space Qualified Packaging
    Mechanical integration of microwave components is often left as the last step while addressing manufacturing considerations for system-level designs. In many cases, the electrical design is analyzed, bread boards are built, electrical designs verified, and then it is left to the mechanical engineers to fit the various components into the final package. This paper shows how component manufacturers can help solve system-level packaging problems using Airstrip technology.