Current Headlines

  1. Ranatec Introduces Panel-Mountable RI 4201 SuperSpeed USB 3.0 Feedthrough Filter 6/3/2025

    Ranatec, a part of Qamcom Group and progressive creator of test and measurement equipment for RF and microwave applications, announced today the introduction of the RI 4201 USB 3.0 Feedthrough Filter.

  2. Samtec Releases Nitrowave Phase And Amplitude Stable Microwave Cable Assemblies To 110 GHz 6/3/2025

    Samtec, Inc., the service leader in the connector industry, announces production quantity availability of its highly stable, low-loss flexible microwave cable assemblies using Nitrowave cable technology.

  3. EECL Debuts Suite Of Plug-And-Play RF & Microwave Testing Tools At IMS2025 6/2/2025

    Expansion into North America marks a major milestone for the UK-based RF Precision engineering company.

  4. Reactel To Exhibit At IMS2025, Booth 632 6/2/2025

    Reactel looks forward to exhibiting at the International Microwave Symposium (IMS), held this year in San Francisco, CA, from June 15-20, 2025. This year, we will feature our full line of application-specific Filters, Multiplexers, and Multifunction Assemblies up to 67 GHz.

  5. Driving 5G Innovation: Ericsson And Telstra Unveil Triple-Band FDD Massive MIMO Radio For Next-Generation Network Performance 6/2/2025

    In yet another pioneering move, Ericsson and Telstra have announced the commercial deployment of the AIR 3284, the world’s first 5G triple-band FDD Massive MIMO radio, delivering a step-change in coverage, capacity, and performance that will serve as a cornerstone of Telstra’s four-year network transformation.

  6. Turkcell Achieves A Global First For 5G Infrastructure 6/1/2025

    Turkcell (NYSE: TKC; BIST: TCELL), in collaboration with Huawei, has achieved a global first by reaching a speed of 50 Gbps in an innovative test, marking a major milestone in wireless communication.

  7. Indium Corporation To Feature Precision Gold-Based Die-Attach Preforms At IMS 2025 5/30/2025

    Indium Corporation will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.

  8. Infineon Launches New Radiation Hardened GaN Transistors, Including One Of The First DLA JANS Certified GaN Device 5/29/2025

    Infineon Technologies AG today announced the first of a new family of radiation hardened Gallium Nitride (GaN) transistors, fabricated at Infineon’s own foundry, based on its proven CoolGan technology.

  9. Taoglas Launches Thunder Series Integrated Antenna Enclosures To Simplify Router Installations And Cut Deployment Costs 5/29/2025

    Taoglas, a trusted provider of advanced antenna and IoT solutions, has launched its new Thunder Series – a high-performance outdoor antenna enclosure platform engineered to support direct integration and installation of the leading industrial routers within the antenna package.

  10. Microsembly Furthers RF Hybrid Manufacturing Services With New Automated Wire Bonding And Die Attach Equipment 5/29/2025

    Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.