Mark Murphy with NXP talks to us about RF solid state energy and his company’s recently achieved breakthroughs in LDMOS performance. We also get a brief tutorial on RF for long distance data transmission as it’s been used in the past, and how RF can be used in an innovate way for heating purposes.
Mike Howard, VP of filter engineering for MtronPTI, discusses his company’s initiatives in expanding their filter product portfolio to support their customer’s need for agile selectivity closer to the antenna. This involves switched filter banks, tunable band pass filters, tunable notch filters, and so on.
Rodd Novak, chief marketing officer for Peregrine Semiconductor gives us a glimpse into his company and their role in applications involving cellular handsets, cellular infrastructure, space, test and measurement, and more. He also goes into detail on Peregrine’s Step 8 technology, an advancement in their semiconductor technology platform roadmap.
George Solomon, senior engineer with CPI (Communications & Power Industries) walks us through their display featuring an X-band SSPA (solid state power amplifier). The amplifier covers the 8.6 GHz to 9.6 GHz frequency range, has a 900 W output power, and is designed in a hermetically sealed integrated assembly.
Peter Nguyen gives us an overview MCLI, a supplier of power dividers, combiners, isolators, circulators, directional couplers, hybrid couplers, lumped element power dividers and combiners, and other passive and active components to help facilitate high frequency electronic communications.
Joe Diesso with AR gives us a brief overview of his company before jumping into some of the products on display at IMS 2013. We get some information on a solid state Class-A amplifier, a 1GHz to 2.5 GHz amplifier, and the recent redesign of the W series of amplifiers by AR. He then turns it over to Chris Heavens with AR Modular RF who talks to us about some new amplifiers that operate in both military and commercial bands.
Brian Bulger with API Technologies gives us a brief overview of his company before going into better detail about their microelectronics capabilities. Of specific note was an RF microwave transmit/receive module; one of the most difficult and demanding types of build-to-print microelectronics.
Martin Timm, director of global marketing with CST sat down with us to talk a little bit about some of the features in the 2013 release of their CST Studio Suite electromagnetic simulation software.
Alan Ake, manager of applications engineering for Skyworks, introduces us to the SKY67151-396LF, an ultra-low noise amplifier ideal for wireless infrastructures. It features the industry’s lowest noise figure for an amplifier and the best single stage gain than any other amplifier currently on the market.
Sonnet provides planar electromagnetic simulation software, and in this video, Robert O’Rourke provides us with information on two exciting new features in the latest release of Sonnet 14 software: the Stackup Manager and Technology Layers.
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