Feature Articles

  1. Solid State Microelectronics, Microfabrication Enable mmWave TWT High-Power Amplifiers And Power Modules

    Further development of microfabrication may enable not only wider bandwidth, but also higher frequency operation of high-power TWTs toward and into the terahertz range.

  2. The Secret To DOD’s Next- Gen Tactical Networks: Open Architecture And Standards

    Absent an open architecture and standards applied to multivendor systems, the military is forced to resort to gateways, translators, and adapters to create something resembling interoperability.

  3. Integrated Circuits (ICs) And Component EMC Testing

    High performance electronic devices demand the use of multi-chip package (MCP), system-on-a-chip (SoC) technologies, and more complex circuits. Due to the increase in emerging technologies, it has become impossible to ignore the large amounts of parasitic emissions generated by such complex integrated circuits (IC’s). Those who produce IC products for demanding electromagnetic environments must also take precautionary measures to test and pass all regulatory EMI and safety requirements to achieve early time to market and profitability. This white paper explores these standards and safety requirements and offers guidance for ensuring that IC products meet them.

  4. 7 Reasons You are Paying Too Much For Your Spectrum Analyzer

    In this article, Signal Hound discusses seven reasons that designers and engineers may be paying too much for their spectrum analyzers and presents alternative solutions for them to consider.

  5. Make Smart Use Of Preamps In RF Testing

    Engineers performing RF enclosure, emissions, or field testing frequently will need to use a preamp with their receiver and associated antenna. Some best practices can improve results and avoid problems.

  6. 5G New Radio Solutions: Revolutionary Applications Here Sooner Than You Think

    5G technologies promise to deliver higher data throughput, extremely low latency, and speeds up to 100 times faster than 4G. This paper explores the practical first steps of a roll out and focuses on the spectrum below 6 GHz as standards for millimeter-wave applications have yet to be determined.

  7. Indium Mounting Procedure

    Indium foil is a thermal interface material used in transistor fixtures between the transistor and the baseplate along with an electrical interface to provide a path to ground for the source connection. Benefits for using indium foil include ease of application, clean surface with no need for surface preparation, and customizable shapes and thicknesses.

  8. Reduce Cost And Complexity In 5G mmWave Systems With Surface Mount Solderable Filter Components

    Components for mmWave 5G communications systems should be chosen for their performance and cost. This white paper explores the use of DLI surface mount solderable filter components in RF systems to reduce the cost and complexity in 5G mmWave systems.

  9. An Introduction To The 5G Frequency Spectrum

    5G networks plan to offer a hundred-fold increase in user data-rates which will require growth in bandwidth over what is currently available. This article introduces the 5G spectrum and explores some of the mechanisms behind the increase in bandwidths.

  10. Empowering Innovation In Startups At Altair Nasdaq Entrepreneurial Event

    The Startup ecosystem, made up of entrepreneurs, universities, investors, and researchers, is a community filled with innovative, thought provoking individuals driven by the desire to produce products and devices to provide a sustainable way of life. Last week Altair had the unique privilege of hosting an event at the Nasdaq Entrepreneurial Center in San Francisco, “Accelerate Your Startup to Market Leadership”, to introduce our technologies to this community through the lens of their peers. Special guest speakers provided their perspectives on the essence of a startup, their passion for innovation, and the importance of the virtual playground.