Pushing The Boundaries Of Packaging

As RF systems move to higher and higher frequencies and wider bandwidths, achieving performance beyond 120 GHz requires a die-level or waveguide approach. The adoption of SMT packaging is expediting the high-frequency design process.

Marki Microwave addresses this with standard packaging platforms that streamline production and design featuring repeatable and consistent performance from simulation to operation.

Marki Microwave continues to push the boundaries of packaging, enabling mmWave operation across the entire RF signal chain.