Marki Microwave 2025 Product Catalog

Marki Microwave integrates time-tested fabrication techniques with modern design methods to push the limits of broadband RF and microwave components. Through proprietary technologies like the T3 Mixer® and high-isolation bridge power combiners, alongside an expanding portfolio of MMIC (Monolithic Microwave Integrated Circuit) devices, Marki Microwave is committed to offering a comprehensive range of high-performance microwave components. Their focus on high-frequency operation, particularly at mmWave and sub-THz frequencies, enables systems with larger bandwidth and more efficient high-resolution imaging and RADAR solutions. These frequencies also allow smaller wavelength signals, contributing to advancements in high-throughput communication systems.

Developing products for these high frequencies requires meticulous attention to detail and the use of advanced 3D simulations to ensure the product functions optimally in real-world conditions. Marki Microwave goes beyond designing MMIC die products by offering diverse form factors optimized for high-frequency performance.

Packaging plays a crucial role in these designs. As products grow more complex, the packaging must be optimized to enhance the design-in process. Marki simplifies the process with user-friendly packaging solutions, available in both surface mount and connectorized forms, often integrating multiple functions into a single package. By co-designing the die and packaging, Marki ensures optimal performance at the board level. Their innovations include chip scale packaging (CSP) that delivers performance up to 90 GHz in a surface mount footprint and flexible M-Package designs supporting DC to 120 GHz in connectorized form, establishing Marki Microwave as a leader in packaging innovation.