Product/Service

G3PO™ Interconnect Series

Source: Corning Gilbert Inc.
A nano-miniature, push-on, high performance, microwave interconnect system. Developed in response to industry demand for increased package density, lower weight, and performance at higher frequencies...
The G3PO offers increased package density, low weight, and performance at high frequency—all desired features for companies that specialize in the development of leading edge technology.

A nano-miniature interconnect system, the G3PO's push-on design enables quick and easy installation. It is the advanced, high frequency blindmate connector of choice in equipment such as manned and unmanned military vehicles, radars, satellites, missiles and wireless systems. Test and measurement applications also benefit from the G3PO's space saving design.

  • Center-to-center spacing of 0.085" and PCB to PCB stack height of 0.120" are available for increased package density.
  • The G3PO blindmate interconnect, Part No. R1R1-0001-01 weighs just 0.2 milligrams.
  • RF Performance from DC to 65 GHz
  • Designed to accommodate both radial and axial misalignment with negligible VSWR change.
  • Adapters available to 1.85mm and SMA.

Corning Gilbert has 50 years of experience in designing and manufacturing high performance connectors for microwave systems and broadband telecommunications. It offers custom design solutions, including multiposition blocks, hermetic shrouds, cable connectors, PCB mounts, adapters and blindmate interconnect (BMI) loads.

Downloads:
•Datasheet: G3PO™ Interconnect Series
•Product Catalog: Microwave Push-On Interconnects