Datasheet | June 27, 2005

Datasheet: G3PO™ Interconnect Series

Source: Corning Gilbert Inc.
A nano-miniature, push-on, high performance, microwave interconnect system. Developed in response to industry demand for increased package density, lower weight, and performance at higher frequencies.
access the Datasheet!

Get unlimited access to:

Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue. X

Enter your credentials below to log in. Not yet a member of RF Globalnet? Subscribe today.

Subscribe to RF Globalnet X

Please enter your email address and create a password to access the full content, Or log in to your account to continue.

or

Subscribe to RF Globalnet