GlobeNewswire Press

  1. STMicroelectronics Signs License And Cooperation Agreement On LDMOS Technology From Innogration
    2/14/2018

    STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has signed an agreement on LDMOS RF power technology from Innogration Technologies, a fabless semiconductor company headquartered in Suzhou, China, specializing in the design and manufacturing of RF power semiconductor devices, modules, and sub-system assemblies.

  2. Verizon, Nokia And Qualcomm Complete First Call Using 3GPP-Compliant 5G NR Tech
    2/12/2018

    Verizon is the first network provider to conduct an over-the-air call on a 3GPP-compliant 5G New Radio (NR) system using licensed spectrum.

  3. Movandi Works With Keysight Technologies To Advance Millimeter Wave Technology And Test Capabilities
    2/8/2018

    Movandi, a venture-backed startup with a mission to revolutionize millimeter wave networks,recently announced its collaboration with Keysight Technologies to test and validate Movandi’s BeamX technology and support optimizing Keysight’s over the air (OTA) test systems.

  4. AVX Acquires Ethertronics
    2/7/2018

    AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control and antenna solutions, has completed its purchase of Ethertronics Inc., a leading manufacturer of passive and active Isolated Magnetic Dipole™ (IMD) antenna systems for wireless applications across the mobile phone, Wi-Fi, defense, aerospace, medical, and IoT markets.

  5. InterDigital Successfully Demonstrates 5G Ready mmW Wireless Crosshaul Transport
    1/31/2018

    InterDigital, Inc. (NASDAQ:IDCC), a mobile technology research and development company, today announced the successful trial and evaluation of the company’s millimeter wave (mmW) EdgeLink™ 60GHz solution and Fast-Forward 70GHz solution that meets new 5G transport requirements as defined by the various 5G standardization groups in 3GPP, ETSI, IEEE, and eCPRI. The solution proved the feasibility of 5G fronthaul upper-layer and lower-layer transport over wireless.

  6. AVX Introduces Six New High-Performance, Low-Pass Integrated Thin Film Filters
    1/30/2018

    AVX Corporation, a leading manufacturer and supplier of passive components, interconnects, sensors, and control solutions, has extended its portfolio of high-performance, low-pass integrated thin film (ITF) filters with the release of six new 8W LP Series filters in miniature 1206 chip sizes with low maximum height profiles of 0.97mm.

  7. New ETS-Lindgren 802.11ac Over-The-Air Measurement Solution Based On LitePoint IQlink WLAN Measurement System
    1/30/2018

    LitePoint, a leading provider of wireless test solutions, announced that ETS-Lindgren has selected the LitePoint IQlink as a standard component of the Antenna Measurement System (AMS) wireless test chambers it builds for customers to test 802.11ac Wi-Fi products.

  8. Nokia Launches ReefShark Chipsets That Deliver Massive Performance Gain In 5G Networks
    1/29/2018

    Nokia has unveiled its new ReefShark chipsets, which leverage in-house silicon expertise to dramatically reduce the size, cost and power consumption of operators' networks and meet the massive compute and radio requirements of 5G.

  9. GLOBALFOUNDRIES Delivering 45nm RF SOI Customer Prototypes For 5G Applications
    1/24/2018

    GLOBALFOUNDRIES today announced that its 45nm RF SOI (45RFSOI) technology platform has been qualified and is ready for volume production. Several customers are currently engaged for this advanced RF SOI process, which is targeted for 5G millimeter-wave (mmWave) front-end module (FEM) applications, including smartphones and next-generation mmWave beamforming systems in future base stations.

  10. AVX Releases Thin Film Chip Inductors For Automotive Signal, Power Applications
    1/22/2018

    AVX Corporation, a leading manufacturer and supplier of passive components, interconnects, sensors, and control solutions, has released a new series of thin film multilayer chip inductors especially designed to meet demanding performance specifications in automotive signal and power applications.