Feature Articles

  1. The Road To 5G Is Paved With Fiber
    2/26/2018

    The most demanding ­5G applications will require fiber for each small cell, but the exact fiber cable requirements for each deployment will differ based on local geography and expected demand. This paper discusses the use of fiber in 5G technologies, as well as how to calculate the amount of fiber needed for 5G in metropolitan areas.

  2. Enabling High Volume Test For Millimeter Wave RF Devices
    2/23/2018

    As the market for millimeter wave devices prepares for exponential growth, one of the issues to be addressed is whether or not testing can be performed at sufficiently high volume and low cost to enable growth in consumer applications. This white paper discusses how DUT interface boards (DIB) address these issues with proven testing volumes exceeding 10 million units per year.

  3. Is An ASIC Right For Your Next IoT Product?
    2/23/2018

    Application specific integrated circuits (ASICs) have become much cheaper and more flexible over the years, offering many more capabilities and significant benefits for a wider range of applications. So how do you know if using an ASIC is ideal for your application? This white paper presents the potential benefits of utilizing an ASIC solution, and discusses methods for reducing costs and increasing value by managing risk and complexity.

  4. Outsourced Operations: Reduce Risk, Accelerate Ramp, Manage Complexity
    2/23/2018

    Companies that are new to semiconductor manufacturing typically do not have the experience and in-house resources to manage the supply chain, and the opportunities they pursue do not allow the time to develop them. The next generation of companies can outsource their operations, providing a method of leveraging the knowledge and relationships of an experienced team to reduce costs, risk, and the potential of failure. This white paper discusses what to consider when outsourcing operations, and what advantages to expect from utilizing this method.

  5. Pioneering Real Wireless Power Delivery At Ossia Inc.: FEKO In The Simulation Process
    2/21/2018

    Ossia Inc. revolutionizes the mobility and connectivity of people and industries through the creation of ecosystems for delivering smart wireless power to the small devices. This case study discusses how the Cota technology works and FEKO has been a powerful enabling tool for technology development at Ossia.

  6. Power Supply Management Of GaN MMIC Power Amplifiers For Pulsed Radar
    2/16/2018

    Today’s management systems must be extremely flexible, reusable, and easily adaptable to various RF amplifier architectures. Their enclosed RF amplifier MMICs are expensive, and as a result, the performance and temperatures of these systems must be monitored in real time.

  7. Conducted And Over The Air Antenna Array Testing – The Way To 5G
    2/15/2018

    5G networks need to be designed to offer more capacity and flexibility while lowering overall systems operation expenses. This paper discusses various test solutions that can address current and future requirements for antenna verification, including conducted and over-the-air test methods.

  8. Wideband Optical Modulator And Detector Characterization: Uncertainties And The Impact On Eye Diagrams/Time Domain Modeling
    2/13/2018

    Optical modulators and detectors have been characterized and calibrated over the years, but less attention has been given to the optimization of converter measurement uncertainties in a practical user context. Since frequency dependencies of various error mechanisms are different, the wide bandwidths could require procedural changes for optimum results. This paper explores these characterization and calibration processes, as well as the net uncertainties, and their impact on example eye diagram generation.

  9. Electronic Packaging: Using EMI Material-Based Solutions
    2/12/2018

    When designing new printed circuit boards for new electronic devices, it is important to consider electromagnetic interference (EMI) shielding solutions early. One of the main issues encountered is when the individual components could pass EMI testing, but as the components are combined into subsystems or into the final product, the device under test (DUT) fails. Incorporating EMI shielding materials as part of an initial design is the most cost-effective way to prevent these last-minute issues during testing.

  10. Microwave Power Dividers And Couplers Tutorial
    2/12/2018

    Power dividers and couplers are straightforward passive components. To design a component with high performance, designers must give attention to design detail, design execution, and fabrication quality. This article discusses power dividers and couplers and defines related terminology.