Business Wire

  1. MaxLinear Adds Two Quad TIA Devices To Telluride Family Of 400Gbps PAM4 Products

    MaxLinear, Inc., a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits for the connected home, wired and wireless infrastructure, and industrial and multimarket applications, recently announced the MxL9154 and MxL9124 quad transimpedance amplifiers (TIA) as new members of its Telluride family of components for linear PAM4 400Gbps network systems. 

  2. Presto Engineering Provides High-Volume Wafer-Level Test For Maja Systems Wireless Data-Center Connectivity Solutions

    Presto Engineering Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, and Maja Systems, a world-leading designer of millimeter wave (mmWave) connectivity and sensing solutions, jointly announce their successful collaboration in comprehensive wafer-level ATE for the Maja AirData family of terabit connectivity and data transport solutions.

  3. Cree Closes € 345M Deal For Infineon’s RF Power Business

    Cree, Inc. has acquired assets of Infineon Technologies AG Radio Frequency (RF) Power Business for approximately € 345M.

  4. MACOM To Showcase RF Portfolio Of MMICs, Diodes And GaN-On-Silicon Devices At EDICON 2018

    MACOM Technology Solutions Inc. (“MACOM”), recently announced that it will be showcasing its industry leading RF Portfolio of MMICs, Diodes and GaN-on-Silicon devices, optimized for enabling a safer, more connected world, at the upcoming Electronic Design Innovation Conference (EDICON) in Beijing, China, March 20th-22nd, 2018.

  5. Comtech Xicom Technology Announces Breakthrough 250-Watt V-Band SATCOM HTS Gateway Uplink Power Amplifier

    Comtech Telecommunications Corp.'s Santa Clara, California-based subsidiary, Comtech Xicom Technology, Inc., which is part of Comtech's Commercial Solutions segment, announced recently a new 250-Watt V-Band amplifier for satellite communications (SATCOM) High-Throughput Satellite (HTS) gateway service.

  6. Taoglas Launches Lightweight, Rugged Antennas for Automotive, Drone Markets

    Taoglas, a leading provider of IoT and automotive antenna and RF solutions, recently at Mobile World Congress 2018 introduced its patent-pending Terrablast range of antennas, a revolutionary, polymer-based series of patch antennas that are 30 percent lighter than their ceramic counterparts and extremely resistant to fracture upon impact.

  7. Spirent Collaborates To Demonstrate 5G Over-The-Air Massive MIMO Beamforming RF Test Bed

    Spirent Communications announced the successful demonstration of an over-the-air test chamber setup at the China Academy of Information and Communication Technology (CAICT) that allows for realistic evaluation of new 5G base station array antenna systems.

  8. MACOM Announces GaN-On-Si MMIC Power Amplifiers For Massive MIMO 5G

    MACOM Technology Solutions Inc. (“MACOM”) recently announced its new MAGM series of GaN-on-Si-based MMIC power amplifiers (“PAs") optimized for massive MIMO antenna systems targeted for 5G wireless basestation infrastructure.

  9. Cree, Inc. Announces Long-Term Silicon Carbide Wafer Supply Agreement With Infineon

    Cree, Inc. announces that it signed a strategic long-term agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to Infineon Technologies AG. 

  10. Skyworks Unveils Suite Of Sky5 Solutions

    Skyworks Solutions, Inc., an innovator of high performance analog semiconductors connecting people, places and things, recently launched its first family of products from its breakthrough Sky5 platform enabling 5G connectivity.