Business Wire

  1. Qualinx To Showcase World's Most Power-Efficient And Only Reconfigurable GNSS Chip And Developer Evaluation Kit At Embedded World 2026 3/5/2026

    Qualinx, the European semiconductor company redefining ultra-low-power connectivity, today announced plans to showcase its market-ready 1 mW QLX3Gx Series GNSS chip with its dynamic reconfigurable architecture, along with a Developer Evaluation Kit (EVK), at Embedded World 2026 from 10-12 March in Nuremberg.

  2. Teledyne Microwave UK Introduces New Wideband Limiter For Advanced Radar Electronic Support Measures And Electronic Warfare Systems 3/3/2026

    Teledyne Microwave UK, part of Teledyne Technologies Incorporated, has announced the release of its new Wideband Limiter, a passive 0.1–20 GHz RF protection module designed to enhance the survivability of Radar Electronic Support Measures (R-ESM) and wider Electronic Warfare (EW) systems operating in increasingly complex threat environments.

  3. LitePoint, Aethertek, And Metanoia Announce Joint Collaboration To Create High Bandwidth Technology For Dense Environments 3/3/2026

    LitePoint, a leading provider of communication test solutions, along with Aethertek, and Metanoia today announced a three‑way collaboration to accelerate the development, validation, and commercialization of next‑generation 5G FR2 (mmWave) Open Radio Units (O‑RUs).

  4. MTFComm Unveils Breakthrough Wireless Technology Delivering Fiber-Optic Speeds Through The Air 3/3/2026

    MTFComm today announced a major wireless communications breakthrough: its pioneering technology has been successfully extended to deliver speeds of up to 24 Gbps using a standard 160 MHz radio channel.

  5. Quectel Launches FCE870Q Wi-Fi7 And Bluetooth 6.0 Module For Low Latency Use Cases 3/3/2026

    Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the FCE870Q Wi-Fi7 and Bluetooth 6.0 module.

  6. Keysight And Qualcomm Advance RF Digital Twins To Scale Massive MIMO And AI-Native 6G Research 3/3/2026

    Keysight Technologies, Inc. collaborated with Qualcomm Technologies, Inc. to accelerate high-precision Radio Frequency (RF) digital twins for massive multiple-input multiple-output (MIMO) development in 5G-Advanced and emerging 6G networks.

  7. HARMAN And Viasat Collaborate To Enable In-Cabin Voice Calls Over Satellite Communications 3/2/2026

    MWC Barcelona 2026 – HARMAN, the automotive technology leader and subsidiary of Samsung Electronics Co., Ltd., announces a new collaboration with Viasat Inc., a global leader in satellite communications, to introduce in-cabin voice calling over satellite connectivity.

  8. Samji Electronics Selects MaxLinear's Sierra Single-Chip Radio For High-Performance Macro O-RU 3/2/2026

    MaxLinear, Inc., a leading provider of wireless infrastructure solutions, today announced that Samji Electronics has selected MaxLinear’s Sierra single‑chip radio system‑on‑chip (SoC) to power its next‑generation Macro Open RAN Radio Unit (O‑RU) (SNOO2‑44N28).

  9. MaxLinear Showcases Accelerating Sierra Momentum With Multiple O-RAN Radio Units At MWC 2026 3/2/2026

    MaxLinear, Inc., a leading provider of wireless infrastructure solutions, today announced that it will showcase a growing range of commercially available Open RAN Radio Units (O-RU) based on its Sierra single‑chip radio SoC at Mobile World Congress (MWC) 2026 in Barcelona.

  10. StratEdge Powers Up For 2026: Showcasing Molded Ceramic Packages At IMAPS Device Packaging And GOMACTech 2/27/2026

    StratEdge Corporation, a leader in the design, production, and assembly of high-frequency, high-power, and high reliability packages, will highlight its molded ceramic and gold plated tab products lines at two March exhibitions.