Datasheet: Turbo Package Analyzer™

Turbo Package Analyzer™ (TPA) provides the package extraction and automation capability needed to address the electrical requirements of today's complex high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with Nexxim® or alternative SPICE-compatible tools to perform subsequent transient analyses, such as crosstalk, overshoot, and TDR.