Thermal Management In High Performance RF And Microwave PCBs

As new RF and microwave systems evolve, there is a greater need for effective thermal management and significantly higher RF performance from Printed Circuit Boards (PCB’s) and subsystems. At the same time, these systems are required to decrease in mass and still offer greater functionality than ever before. This paper reviews the various methods of thermal management and reviews in detail the advantages of “Coin” technology versus traditional thermal via technology. Download the full paper for more information.