Article | April 22, 2024

Thermal Design For Semiconductors And High Power GaN

Source: Qorvo

By David Schnaufer, Technical Marketing Communications Manager

GettyImages-1427734570 PCB circuit board

Navigating the complex field of thermal design can be intimidating, with its maze of rules, technical terms, and equations. However, neglecting this crucial aspect can be dangerous as temperature is the primary environmental enemy that shortens the lifespan of semiconductors in real-world applications. Even a slight increase in temperature can significantly reduce the longevity of components.

In this discussion, we dive headfirst into the realm of thermal management, focusing on the challenges and solutions surrounding high-power gallium nitride (GaN) devices. We will unravel the complexities, examine the fundamentals, and explore innovative strategies to improve reliability and optimize performance in the face of increasing thermal demands.

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