TelASIC Introduces CPRI Module For 3G/3.5G (HSDPA) Remote Radio Heads
"For successful deployment of high bandwidth and/or low latency data services based on HSDPA, coverage is a critical issue for all operators," said Ashis Khan, Vice President, Sales and Marketing for TelASIC. "Operators are increasingly choosing to deploy low power, small footprint CPRI-based remote radio heads, consisting of the power amplifier (PA), transceiver, and filters, to provide better coverage. TelASIC's exhaustively tested and characterized CPRI solution will help accelerate and de-risk OEMs' development of CPRI-compliant remote radio head products."
The CPRI module for the RE and the REC provides header connectors for accepting digital I/Q signals and incorporates TelASIC's CPRI network processor, clock recovery circuitry, jitter-cleaning phase locked loop (PLL) with VCXO, SERDES, SFP optical module, and support for both HDLC and Ethernet. TelASIC has worked closely with multiple basestation manufacturers to customize the board for dimensions, fast recovery during a link-loss, and other proprietary features.
The CPRI interface enables operators to deploy radio heads wherever coverage is needed, not necessarily where the basestation is located. Low power, small footprint and light weight are the three most important criteria for remote radio heads. TelASIC's digital predistortion (DPD) technology enables OEMs to significantly reduce power, size, and weight by replacing bulky and power-hungry PAs that use analog techniques for linearization. High power efficiency achieved by TelASIC's DPD techniques enables OEMs to dispense with expensive air-conditioning requirements as well. TelASIC's CPRI offering enables the use of ultra light fibers that replace the heavy cables used in legacy radios. Overall, operators can deploy remote radio heads on building tops or antenna towers as and when needed for better coverage, saving large capital expenditures for site acquisition and civil works.
A CPRI development kit (part number TC0007) for the CPRI module is currently available for sale. TelASIC will demonstrate the development kit at the 3G World Congress & Exhibition during November 14-18 at the Hong Kong Convention and Exhibition Center, booth #1936.
SOURCE: TelASIC Communications