TE Connectivity Features Innovative Next-Gen Solutions At MILCOM 2012

TE to Showcase the Latest End-To-End Solutions 

TE Connectivity (TE) will be featuring a range of next-gen military electronics technologies at this year’s MILCOM, as well as the latest end-to-end solutions from the widest stable of high performance interconnects anywhere in the world. These new high-speed connectivity solutions will be on display at Booth 1708 on October 29-November 1, in Orlando, FL.

The following products and solutions will be featured
Advanced Composites & Antennas - High performance polymers and composite solutions for harsh, high temperature and corrosive environments that meet critical demands for thermal management, EMI shielding and enhanced SWaP.

CeeLok FAS-T Connector - The most rugged, small form factor, field terminable, I/O connector that meets high-speed 10Gb/s Ethernet performance.

Cold Applied Splice - Designed as a single component in-line splice to provide high environmental protection to seal the termination from moisture and provide electrical isolation.

Deutsch MIL-DTL 38999 Series Connectors - Circular connectors in accordance with MIL-DTL-38999 SIII.

Deutsch Wildcat Connectors - Specifically designed for harsh environment applications where space and weight savings are of critical importance.

Expanded Beam Optical Connectors - Rugged optics and fiber optic technology provides a clean transmission path in bandwidth and capacity.

Mezalok Mezzanine Connector - A high-reliability mezzanine connector that more than doubles the speed and durability of competing technology, making it the most viable option for adverse environments.

Power Distribution Panels - HARTMAN AC and DC power distribution units (PDUs) and KILOVAC DC PDUs from TE are designed, built and qualified to meet specific requirements.

RT-555 High Temperature Heat Shrink Tape - A bi-layer, side-entry, heat-recoverable sealing product for wire harness bundles saves time and resources.

For more information on any of these connectivity solutions, contact the Product Information, visit www.te.com/en/tradeshows/2012/milcom-2012.html.

CeeLok FAS-T, Mezalok, TE Connectivity and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.

About TE Connectivity
TE Connectivity is a global, $14B company that designs and manufactures approximately 500,000 products that connect and protect the flow of power and data inside the products that touch every aspect of our lives. Our nearly 100,000 employees partner with customers in virtually every industry—from consumer electronics, energy and healthcare, to automotive, aerospace and communication networks—enabling smarter, faster, better technologies to connect products to possibilities. For more information, visit www.te.com.