Taconic Introduces Low-Loss, High-Frequency Laminates

San Francisco -- IEEE MTT-S International Microwave Symposium -- Taconic has introduced HyRelex, a family of low-loss, thin, flexible interconnect materials. HyRelex laminates can be used in conjunction with HyRelex bond-ply and cover-lay for a range of applications including high-frequency circuits and controlled impedance low loss cables. HyRelex is able to retain its electrical and mechanical properties in applications exposed to harsh environments.

"The new HyRelex family enables high frequency applications to fit varying form factors using flex and rigid flex circuit technology. Additionally, HyRelex is based on established material technology which means that current PTFE circuit processing knowledge is all that is required to process this new, high-performance circuit material," stated Robert Nurmi, Vice President of Corporate Development.

HyRelex laminates are available with dielectric constants of 2.60 and 2.90, along with closely matched Bond-plies (dk 2.70, 3.00) and Cover-Lays (dk 2.70). Laminates are available as thin as 0.001" ( 25 µm) and can be ordered with various copper styles.

SOURCE: Taconic