The Q3D Extractor® Software from Ansoft. Multi-layer boards, complex IC packages, and 3D on-chip passive structures are common in today's high-performance electronic designs...
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Brochure: Q3D Extractor®
Q3D Extractor® is the premier 3-D parasitic extraction software tool for engineers designing multi-layer boards, complex IC packages and 3-D on-chip passive components. Q3D Extractor efficiently performs the 3-D and 2-D electromagnetic-field simulation required for the extraction of RLCG parameters from an interconnect structure and automatically generates an equivalent SPICE sub-circuit model. These highly accurate models can then be used to perform signal integrity analysis to study EM phenomena, such as crosstalk, ground bounce, interconnect delays, and ringing, and to understand the performance of high-speed electronic designs.
New in Q3D Extractor v8
New Capacitance solver in Q3D Extractor that solves for C and G due to lossy dielectrics
Infinite ground plane capability
Multiprocessing and Distributed Analysis options
Revised interface for 2D Extractor:
Improved 2-D modeling
Simplified problem setup
Ability to perform discrete and interpolating frequency sweeps
New optional convergence criteria using power loss
Finite Conductivity Boundary added for surface roughness modeling
Advanced product coupling capability with Ansoft Designer and Simplorer
Frequency-dependent dielectric loss model (Djordjevic-Sarkar)