Smiths Interconnect To Showcase Next-Generation Test Solutions At DesignCon 2026

DesignCon, the United States' premier annual gathering for chip, board and systems design engineers, will take place at the Santa Clara Convention Centre from 24 to 26 February 2026. For over three decades, this flagship Silicon Valley event has provided a vital platform for industry professionals to explore cutting-edge solutions to critical signal and power integrity issues.

As a global leader in semiconductor test sockets, Smiths Interconnect is proud to announce its participation in this prestigious conference and exhibition. We will present a comprehensive range of our Star Test products, showcasing solutions designed for the next generation of technology in AI PCs, enterprise data centres (EDCs), automotive electronics, and the Internet of Things (IoT).

Spotlight on Innovation: DaVinci Gen V High-Speed Test Socket
The DaVinci Gen V High-Speed Test Socket, Smiths Interconnect's latest flagship product, will be the star of the show. Designed to meet the extreme demands of high-performance computing and AI data centres, it delivers breakthrough high-speed signal transmission and performance. It enables digital signalling speeds of up to 224 Gbps PAM4 for AI accelerators and over 100 GHz for 6G communications. These speeds are crucial for meeting the growing demand for massive data transfer.

Product features:

• Solution for BGA, LGA and other variants
• Spring probe technology using a homogeneous alloy with gold plating for better grounding
• RF bandwidth of >84 GHz @ -1 dB IL
• Short signal path: 4.90 mm test height
• Impedance tuned to match the system
• Consistent stable contact resistance of 55 mΩ (avg.)
• Hi-coplanarity accommodation
• Tri-temp socket design to support -55 °C to +150 °C
• Designed for manual, bench and HVM production testing using the same socket

High-Power Burn-In Test Socket
Smiths Interconnect’s high-power burn-in socket is a specialised electromechanical interface that temporarily connects semiconductor devices, such as CPUs, GPUs, AI accelerators, and high-power discrete components, to test boards during the burn-in and stress testing phases of manufacturing.

Its primary function is to provide a robust and reliable connection that can often be automated and withstand extreme conditions far beyond normal operation, specifically:

• To support next-generation devices with up to 22,000 contacts and a size of 150 x 150 mm
• Capable of managing up to 2000 W of power with integrated liquid cooling
• Universally compatible with all advanced burn-in chamber platforms
• Designed to deliver a 500 lb applied load with a maximum closing force of 15 lb
• Flexible thermal options, including passive heatsinks and heat pipes

This burn-in socket is built for durability and thermal and electrical stability under extreme stress conditions.

Attendees are invited to visit Booth 508 to experience Smiths Interconnect's cutting-edge technologies first-hand and to engage with technical experts.