Smiths Interconnect Launches EZiCoax, Single-Piece Coax For Interposer Solutions

Smiths Interconnect proudly announced today the launch of EZiCoax, a single-piece, compression mount, 50-ohm RF coaxial contact for use in board-to-board signal transmissions. EziCoax delivers exceptional performance, with data frequency up to 40 GHz, and is designed to be used in high-value aerospace and defence applications, such as satellite communications and advanced radar sy­­stems, where it will help enable secure, precise and reliable communications, fundamental to the success of space and defence operations.

A recognized pioneer in spring probe technology, Smiths Interconnect brings decades of expertise to the design of spring-compliant contacts and interposer connectors. EZiCoax leverages this heritage, employing spring probe technology in both its center and outer conductors to create a fully compliant connection between printed circuit boards (PCBs). The smallest coax offering has a low profile down to a 3.30 mm board-to-board distance and can be used on a pitch as small as 3 mm. EZiCoax is designed to be incorporated in interposer solutions that assure alignment and offer the opportunity to integrate various types of signal and power contacts, as well as additional features such as gasketing and bosses which further enhance compliance and versatility.

The development of EZiCoax is Smiths Interconnect’s answer to the demand, from leading players in the market, for solderless, compression mount solutions in High-Frequency data signalling.

Mark Kelleher, Connectors BU Director at Smiths Interconnect, commented: “EZiCoax is an effective solution developed to meet the strict requirements of the most demanding applications. With its recognised advantages in terms of ease of assembly and rework, this solution helps reduce production scrap, by minimizing the risk of damage to both PCBs and connectors during assembly. Compared to traditional solder SMP connectors, EZiCoax interposers, with lower mating and unmating forces applied to the PCBs and the reduced use of board stiffeners, deliver a reliable and customizable solution, allowing the integration of mixed digital and power contacts in one array ”.

EZiCoax is a solderless solution, needing no solder on the PCBs for connection. Each contact requires less than 5 oz. compression force to provide a reliable connection and no extraction force is required for a spring loaded solution. EZiCoax requires little assembly work, it is sufficient to align to the PCB and compress for a reliable connection. Hence, EziCoax interposers can be installed and uninstalled with minimum effort. Furthermore, the minimal forces involved mean that EZiCoax interposers can withstand a higher number of mating and de-mating cycles, offering a lower cost of ownership compared to existing commercial solutions, with reduced maintenance requirements and an extended product’s lifespan.

EZiCoax interposers are inherently compliant and provide reliable blind-mate capabilities. They are an ideal approach for the quick disconnect of applications for system repair or replacement. EZiCoax Interposers can effectively overcome target misalignment as spring probe connectors are compliant by design and require only a flat pad as their target. Contact is maintained as long as the probe tip touches any point within the target, ensuring forgiveness of any misalignment.

EZiCoax Interposers are able to perform to frequency rates for data signalling up to 40 GHz with minimal insertion loss (less than -1 dB). They are designed to offer superior shielding from stray signals and provide excellent cross-talk characteristics. The capability to perform up to the Extremely High Frequency range (EHF) and the superior mechanical and electrical reliability make EZiCoax suitable for the most demanding data signalling applications, including:

• Satellite-to-ground and inter-satellite communications that enable secure and effective mission control coordination.
• Ground and air-to ground advanced radar systems for precision targeting, enhanced surveillance, and for the detection of threats and collision risks in defence and space evironments.
• 5G and future-generation wireless networks for ultra-high-speed communication.

Compared to existing commercial solutions, Smiths Interconnect’s EZiCoax offers easier and faster integration and assembly, superior data signalling speed performance, exceptional mechanical and electrical reliability and the premium quality service and technical heritage of a recognized leader in spring-probe interconnect solutions for the space, defence and telecommunication markets.