White Paper

Sequential Peeling: A Model-Based Approach To Structure Identification And De-Embedding

Source: Anritsu Company
peeling

Sequential peeling is a model/measurement-based method of network extraction for de-embedding. This paper is about one of those model-based approaches that uses position information about structures in the fixture, and an indicated impedance/admittance model to extract parameters of that particular structure. Since position information is used, one structure can be de-embedded after another. In a sense, this is peeling away one layer of the fixture at a time which is the source of the name of the method. The process involved in this method will be discussed in this paper along with the assumptions being made and the sensitivities that might be encountered. Download the paper for more information.