Rogers To Showcase Advanced Circuit Materials At MTT-S

Rogers, CT -- Rogers Corporation will showcase several advanced circuit materials at the IEEE MTT-S International Microwave Symposium 2007 in Honolulu, Hawaii, June 5-7 (Booth #843). These products are used in a wide range of high-frequency applications, including the advanced packaging, antenna, and power amplifier markets.

Previously Rogers Corporation has developed products such as the RT/duroid 5000 series, RT/duroid 6002, RO3000, RO4000, and TMM laminates. Rogers Corporation also has global resources with offices located in Europe and the United States, as well as a strong presence in the Asia Pacific with facilities in China, Singapore, Japan, Korea and Taiwan.

Products that Rogers Corporation will display at IEEE/MTT-S IMS 2007 include:

Advanced Packaging Materials

• Thermoset Materials: Products such as RO4350B, RO4450B, and RO4450D laminates offer low moisture absorption and low loss, as well as FR4 and lead-free multi-layer processing capabilities. They are also available in .004"-.060" thicknesses.
• Thermoplastic Materials: The RO2800 and ULTRALAM 3000 materials are available in thin dielectric layers (.001"-.004") and exhibit low loss and low moisture absorption. They also are lead-free, making them environmentally friendly.

New Enhanced Copper Bond Technology

• This low profile copper technology provides tighter trace width tolerances, lower insertion loss, and improved passive intermodulation at high operating frequencies.

Antenna Grade Materials

• This wide range of antenna grade materials exhibit losses as low as .0013 and PIM values better than -155 dBc. A variety of options including thick dielectric grades and high Dk are also available.

SOURCE: Rogers Corporation