RF/Microwave material
ComClad HF high frequency circuit material consists of Noryl plastic material as the base dielectric
N/Ahigh frequency circuit material consists of Noryl plastic material as the base dielectric. It features a combination of a dielectric constant of 2.6 and a dissipation factor of .0025. It is available in standard circuit board panel sizes of 12" x 18" and 18" x 24" with a variety of standard dielectric thicknesses and copper cladding. Flexible manufacturing also allows for custom designs of panel size, thickness and copper clad. The material processes through standard printed circuit board manufacturing operations.
N/Ais rated at continuous operating temperatures of -40°C - +85°C and can be SMT or through hole soldered with shielding fixtures to prevent direct heat contact to the material. Applications include cellular and PCS base stations, direct broadcast antennas, wireless LANs, antennas for various applications, automotive collision avoidance radar and three-dimensional circuit boards.
N/Ais rated at continuous operating temperatures of -40°C - +85°C and can be SMT or through hole soldered with shielding fixtures to prevent direct heat contact to the material. Applications include cellular and PCS base stations, direct broadcast antennas, wireless LANs, antennas for various applications, automotive collision avoidance radar and three-dimensional circuit boards.
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