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CuClad: RF & Microwave Laminates

Source: Arlon Materials for Electronics

CuClad: RF & Microwave Laminates
CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability

Click Here To Download:
Datasheet: CuClad Series
Fabrication Guidelines: Arlon DiClad, CuClad, IsoClad and AD Series Laminates
Microwave And RF Materials Guide

CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability.

The woven fiberglass reinforcement in CuClad products provides greater dimensional stability than non-woven fiberglass reinforced PTFE based laminates of similar dielectric constants. The consistency and control of the PTFE coated fiberglass cloth allows Arlon to offer a greater variety of dielectric constants and produces a laminate with better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates. These properties make Cu- Clad an attractive choice for filters, couplers and low noise amplifiers.

CuClad laminates are crossplied (alternating layers of coated fiberglass plies are oriented 90o to each other). This provides true electrical and mechanical isotropy in the XY plane, a feature unique to CuClad. No other woven or nonwoven fiberglass reinforced PTFE based laminates make this claim. Designers have found this degree of isotropy critical in some phased array antenna applications.

Traditional Products  - High PTFE to Glass Ratio, Lowest Loss

 

Woven Fiberglass Reinforced PTFE - Crossplied

 

 

CuClad 250GT

2.40 - 2.60 ± 0.05 

0.001

GT  /01

CuClad Series Processing Guidelines

CuClad 250GX

2.40 - 2.60  ± 0.04

0.0018

GX  /02

CuClad 233LX

2.33 ± 0.02

0.0013

GY  /05

CuClad 217LX

2.17, 2.20 ± 0.02

0.0009

GY  /05

 

 

 

 

* Mil-S-13949 inactivated

Click Here To Download:
Datasheet: CuClad Series
Fabrication Guidelines: Arlon DiClad, CuClad, IsoClad and AD Series Laminates
Microwave And RF Materials Guide