Product/Service

RF And Microwave Laminates

Source: Arlon Materials for Electronics

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Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.

Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.

Microwave Materials
DiClad Series - unidirectional woven fiberglass / PTFE laminates available in a range of Dk's (2.17 to 2.6) and loss values (0.0009 to 0.0022).  Lowest Loss Products.
DiClad RF & Microwave Laminates
CuClad Series - cross-plied woven fiberglass / PTFE laminates available in a range of Dk's (2.17 to 2.6) and loss (0.0009 to 0.0022). The sequential layers of fabric are cross-plied to ensure in-plane isotropy for applications requiring matched electrical properties in the X-Y plane. Lowest Loss Products.
CuClad Series RF & Microwave Laminates
IsoClad Series – non-woven glass / PTFE laminates available in a range of Dk's (2.17, 2.33) and loss (0.0013-0.0016). These materials offer lower modulus permitting a more flexible thin laminate than is typical with a woven glass reinforced product.  Excellent for formable/bendable antennas.  Low Loss Products.
IsoClad RF & Microwave Laminates
CLTE Series – woven-glass / PTFE / microdispersed ceramic laminates. CLTE offers highest Dk (2.94) Stability vs. Temperature critical for Phase Sensitive Applications. Very Low CTE Values.  Excellent dimensional stability; ideal for thin core, multi-layer boards; highest degree of embedded resistor consistency in the industry.  High Performance Laminates for Avionics, Radars, EW, SIGINT, CNI (Communications, Navigation, Identification), and Phase Sensitive Filters. 
CLTE RF & Microwave Laminates
PTFE reinforced with Commercial Grade Glass (AD250 through AD320) - Range of Dk's (2.5-3.2) and loss (0.0018 – 0.003). These are Arlon's low cost PTFE products that nonetheless retain the frequency stable dielectric properties of Teflon.
TC Series Of Thermally Conductive Microwave Laminates
High Thermal Conductivity, Temperature Phase Stable, Low CTE Laminates.  Excellent for Heat Dissipation, reduces Junction Temperatures, improves device and solder joint reliability.  Excellent  for Power Amplifiers and Antennas Sensitive to Dielectric Constant changes with Temperature.
AD Series Laminates RF & Microwave Laminates
PTFE and micro dispersed ceramic reinforced with Commercial Grade Glass (AD260A through AD450) - Range of Dk's (2.6-4.5) and loss (0.0018 – 0.0035).   Low Cost.
AD Series Laminates RF & Microwave Laminates
Higher Dielectric Constant, Reinforced PTFE with micro dispersed Ceramic - AD600 and AD1000 - Dk of 6.15 and 10.2.  Low Loss.  Ideal for microwave circuit miniaturization.
AD1000 RF & Microwave Laminates
DiClad-PIM and AD-PIM Series – these special DiClad and AD series constructions are designed to minimize Passive Intermodulation Distortion that is important to antenna systems.
PIM Series RF & Microwave Laminates
Non-PTFE Low Loss, 25N and 25FR – a homogenous laminate and prepreg system, processable in a conventional FR-4 process. Dk's and loss are 3.38, 3.58 and 0.0025, 0.003 respectively.
25N/FR
Bonding Materials - thermoplastic bonding materials for producing multilayer PTFE circuit boards or bonding PTFE boards to heatsinks or FR-4 boards.