Parameter Extraction Package
A package includes a high-frequency extension for MOS/CMOS modeling in the HP IC-CAP device modeling software
A package includes a high-frequency extension for MOS/CMOS modeling in the HP IC-CAP device modeling software. This BSIM 3v3.2 model parameter extraction package contains the latest release of the UC Berkeley BSIM3v3.2MOS model, extraction templates, and a modeling toolkit. Developed within the HP IC-CAP framework by Advanced Modeling Solutions (Frickenhausen, Germany), the software is well suited for use in the design of silicon ICs for communications applications.
Hewlett-Packard Co., Test & Measurement Organization, 5301 Stevens Creek Boulevard, MS 54LAK, Santa Clara, CA 95052-8059. Phone: 800-537-7715, ext. 10055.