PA&E To Highlight Integrated Manufacturing Capabilities AT IMS 2009

Wenatchee, WA -- PA&E will be highlighting its EMI filter, hermetic interconnect, and electronic packaging technology at the 2009 IEEE MTT-S International Microwave Symposium, held June 7-12 at the Boston Convention Center in Boston, MA. PA&E application engineers will be available in Booth 1827 throughout the show to discuss electronic component engineering challenges with attendees and to answer questions about the company's products and integrated manufacturing capabilities.

First held on the Harvard campus in 1959, the International Microwave Symposium (IMS) has grown into the world's premier microwave conference. It features a large trade show and technical presentations, workshops and panel sessions covering a wide range of topics. The event is designed for engineers working on wireless communications, radar, RF technologies, high frequency semiconductors, electromagnetics, commercial and military RF, microwave and mm-wave electronics applications.

The exhibit hall will be open on June 9 and 10 from 8:00 am to 5:00 pm and on Thursday, June 11 from 9 am to 3 pm. Those interested in registering for this event should visit the conference site at http://www.ims2009.org. Advanced registration for the conference is open until June 5 and there's an "Exhibits Only" pass available for $20.

For more information about PA&E, or to learn more about the company's interconnect products, EMI filters, integrated electronic packaging and explosive metal bonding capabilities, contact PA&E at 509-664-8000 or visit us at www.pacaero.com.

PA&E, Inc. is an integrated manufacturing company, specializing in technically demanding ceramic and metal components and assemblies, hermetic connectors and advanced micro-electronic hermetic packaging for global leaders in the defense, space, medical and commercial industries. PA&E is ISO 9001:2000/AS9100 Rev B certified and NADCAP compliant.

SOURCE: PA&E, Inc.