News | June 3, 2011

NXP Introduces New Plastic Packages For RF Power Transistors

1907th

Cost-effective package solutions for all RF applications

Eindhoven, Netherlands – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the launch of a complete line of overmolded plastic (OMP) RF power devices with peak powers ranging from 2.5 to 200 Watts. The new range of OMP devices will be introduced as a complement to NXP's extensive range of products in ceramic packages, providing customers a choice for more cost-sensitive applications, while maintaining the required level of RF performance.

NXP's OMP roadmap covers all the high-volume frequency ranges and applications: 10 – 500-MHz ISM, 470 860-MHz broadcast, 700 – 2200-MHz GSM, WCDMA telecom, 2300 – 2700-MHz LTE telecom, 2.45 GHz ISM, and even products for the 2700 – 3500-MHz S-band. Product types will extend to all existing categories: discrete pre-drivers (2.5 – 10 W), drivers (20 – 45 W), MMICs (20 – 60 W), finals (50 - 200 W) and integrated Doherty devices (50 – 110 W).

OMP products up to 10 W will utilize NXP's existing IC packages, with new footprint packages developed for higher powers. For customers using full surface mount assembly, gull-wing versions will be available in addition to traditional straight-lead versions. A limited selection of devices is available today as engineering samples, with volume production scheduled to start in Q4 2011.

Product Features

  • Product solutions from DC to 3500 MHz
  • Single-stage broadband drivers in HVSON, from 2.5 to 10W
  • Single-stage drivers from 25 to 45 W
  • Dual-stage MMICs from 20 to 60 W which can be used as high-gain drivers or combined as low power dual-stage Doherty amplifiers
  • Fully integrated plug-and-play Doherty PAs in a single package (50 to 110 W)
  • SOT502-sized, single-ended and push-pull final transistors ranging from 50 to 200 W

"Compared to ceramic, overmolded plastic can significantly reduce the overall BOM cost by 20 percent, offering customers a clear choice in cost versus performance. As a complement to our existing product portfolio, the new OMP RF power devices give design engineers added flexibility and demonstrate our ongoing commitment to RF power," said Mark Murphy, director of RF power products, NXP Semiconductors.

About NXP HPRF
Shipping more than 4 billion RF products annually, NXP is a clear industry leader in High Performance RF. From satellite receivers, cellular base stations and broadcast transmitters to ISM (Industrial, Scientific, and Medical) and aerospace and defense applications, NXP is a leader in High Performance Mixed Signal IC products and the recognized leader in SERDES-based serial interfaces for high speed converters. NXP offers a broad selection of high-speed data converters, with digital interfaces including JESD204A compliant CGV, CMOS LVCMOS and LVDS DDR interfaces. These high speed converters are suitable for wireless infrastructure, industrial, scientific, medical, aerospace and defense applications.

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.

SOURCE: NXP Semiconductors N.V.